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參數(shù)資料
型號： S29GL032A90TAIR22
廠商： SPANSION LLC
元件分類： PROM
英文描述： 64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
中文描述： 2M X 16 FLASH 3V PROM, 90 ns, PDSO56
封裝： MO-142EC, TSOP-56
文件頁數(shù)： 92/95頁
文件大?。?/td> 3585K
代理商： S29GL032A90TAIR22
92
S29GL-A
S29GL-A_00_A12 May 21, 2008
Da ta
Sh e e t
18.5
VBK048—Ball Fine-pitch Ball Grid Array (BGA) 8.15x 6.15 mm Package
3338 \ 16-038.25 \ 10.05.04
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
SIDE VIEW
TOP VIEW
SEATING PLANE
A2
A
(4X)
0.10
10
D
E
C
0.10
A1
C
B
A
C
0.08
BOTTOM VIEW
A1 CORNER
B
A
M
φ 0.15
C
M
7
6
e
SE
SD
6
5
4
3
2
A
B
C
D
E
F
G
1
H
φb
E1
D1
C
φ 0.08
PIN A1
CORNER
INDEX MARK
PACKAGE
VBK 048
JEDEC
N/A
8.15 mm x 6.15 mm NOM
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
---
1.00
OVERALL THICKNESS
A1
0.18
---
BALL HEIGHT
A2
0.62
---
0.76
BODY THICKNESS
D
8.15 BSC.
BODY SIZE
E
6.15 BSC.
BODY SIZE
D1
5.60 BSC.
BALL FOOTPRINT
E1
4.00 BSC.
BALL FOOTPRINT
MD
8
ROW MATRIX SIZE D DIRECTION
ME
6
ROW MATRIX SIZE E DIRECTION
N
48
TOTAL BALL COUNT
φb
0.35
---
0.43
BALL DIAMETER
e
0.80 BSC.
BALL PITCH
SD / SE
0.40 BSC.
SOLDER BALL PLACEMENT
---
DEPOPULATED SOLDER BALLS
相關(guān)PDF資料
PDF描述
S29GL032A90TAIR23 64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
S29GL032A90TAIR30 64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
S29GL032A90TAIR32 64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
S29GL032A90TAIR13 64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
S29GL032M10BFIR20 T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 220uF; Working Voltage (Vdc)[max]: 4V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 9.0mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
S29GL032A90TAIR23 制造商:SPANSION 制造商全稱:SPANSION 功能描述:64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
S29GL032A90TAIR30 制造商:SPANSION 制造商全稱:SPANSION 功能描述:64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
S29GL032A90TAIR31 制造商:SPANSION 制造商全稱:SPANSION 功能描述:64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
S29GL032A90TAIR32 制造商:SPANSION 制造商全稱:SPANSION 功能描述:64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
S29GL032A90TAIR33 制造商:SPANSION 制造商全稱:SPANSION 功能描述:64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
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