
●
●
●
▲
{
{
{
Absolute Maximum Ratings
Symbol
Parameter
Value
Units
V
DSS
Drain to Source Voltage
60
V
I
D
Continuous Drain Current(@T
C
= 25
°C)
50
A
Continuous Drain Current(@T
C
= 100
°C)
35.2
A
I
DM
Drain Current Pulsed
(Note 1)
200
±
20
A
V
GS
Gate to Source Voltage
V
E
AS
E
AR
I
AR
dv/dt
Single Pulsed Avalanche Energy
(Note 2)
470
mJ
Repetitive Avalanche Energy
(Note 1)
13
mJ
Avalnche Current
(Note 1)
50
A
Peak Diode Recovery dv/dt
(Note 3)
7
V/ns
P
D
Total Power Dissipation(@T
C
= 25 °C)
130
W
Derating Factor above 25 °C
0.87
W/°C
T
STG,
T
J
Operating Junction Temperature & Storage Temperature
- 55 ~ 175
°C
T
L
Maximum Lead Temperature for soldering purpose,
1/8 from Case for 5 seconds.
300
°C
Thermal Characteristics
Symbol
Parameter
Value
Typ.
Units
Min.
Max.
R
θ
JC
R
θ
CS
R
θ
JA
Thermal Resistance, Junction-to-Case
-
-
1.15
°C/W
Thermal Resistance, Case to Sink
-
0.5
-
°C/W
Thermal Resistance, Junction-to-Ambient
-
-
62.5
°C/W
S FP50N06
December, 2002. Rev. 1.
1/7
Features
■
Low R
DS
(on) (0.023
)@V
GS
=10V
■
Low Gate Charge
(Typical 39nC)
■
Low Crss
(Typical 110pF)
■
Improved dv/dt Capability
■
100% Avalanche Tested
■
Maximum Junction Temperature Range
(175°C)
General Description
This Power MOSFET is produced using SemiWell’s advanced
planar stripe, DMOS technology. This latest technology has been
especially designed to minimize on-state resistance, have a low
gate charge with superior switching performance, and rugged
avalanche characteristics. This Power MOSFET is well suited
for synchronous DC-DC Converters and Power Management in
portable and battery operated products.
N-Channel MOSFET
S emiWell
Semiconductor
Copyright@SemiWell Semiconductor Co., Ltd., All rights reserved.
Symbol
2. Drain
3. Source
1. Gate
TO-220
123