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參數(shù)資料
型號: SM320C2550GBM
廠商: TEXAS INSTRUMENTS INC
元件分類: 數(shù)字信號處理
英文描述: 16-BIT, 50 MHz, OTHER DSP, CPGA68
封裝: CERAMIC, MO-067AA, MO-066AA, PGA-68
文件頁數(shù): 1/40頁
文件大小: 681K
代理商: SM320C2550GBM
SMJ320C25, SMJ320C2550
DIGITAL SIGNAL PROCESSOR
SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001
1
POST OFFICE BOX 1443
HOUSTON, TEXAS 77251–1443
D Military Temperature Range
– –55
°C to 125°C
D 100-ns or 80-ns Instruction Cycle Times
D 544 Words of Programmable On-Chip Data
RAM
D 4K Words of On-Chip Program ROM
D 128K Words of Data/Program Space
D 16 Input and 16 Output Channels
D 16-Bit Parallel Interface
D Directly Accessible External Data Memory
Space
– Global Data Memory Interface
D 16-Bit Instruction and Data Words
D 16 × 16-Bit Multiplier With a 32-Bit Product
D 32-Bit ALU and Accumulator
D Single-Cycle Multiply/Accumulate
Instructions
D 0 to 16-Bit Scaling Shifter
D Bit Manipulation and Logical Instructions
D Instruction Set Support for Floating-Point
Operations, Adaptive Filtering, and
Extended-Precision Arithmetic
D Block Moves for Data/Program
Management
D Repeat Instructions for Efficient Use of
Program Space
D Eight Auxiliary Registers and Dedicated
Arithmetic Unit for Indirect Addressing
D Serial Port for Direct Code Interface
D Synchronization Input for Synchronous
Multiprocessor Configurations
D Wait States for Communication to
Slow-Off-Chip Memories/Peripherals
D On-Chip Timer for Control Operations
D Three External Maskable User Interrupts
D Input Pin Polled by Software Branch
Instruction
D 1.6-m CMOS Technology
D Programmable Output Pin for Signaling
External Devices
D Single 5-V Supply
D On-Chip Clock Generator
D Packaging:
– 68-Pin Leaded Ceramic Chip Carrier (FJ
Suffix)
– 68-Pin Ceramic Grid Array (GB Suffix)
– 68-Pin Leadless Ceramic Chip Carrier
(FD Suffix)
Copyright
2001, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
IACK
MSC
CLKOUT1
CLKOUT2
XF
HOLDA
DX
FSX
X2 CLKIN
X1
BR
D8
D9
D10
D1
1
D12
D13
D14
D15
READY
CLKR
CLKX
STRB
R/W
PS
IS
DS
VSS
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61
VSS
D7
D6
D5
D4
D3
D2
D1
D0
SYNC
INT0
INT1
INT2
VCC
DR
FSR
A0
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A1
1
A12
A13
A14
A15
V
SS
V
CC
V
CC
V
CC
68-Pin FJ and FD Packages
(Top View)
On products compliant to MILPRF38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
12
3456789 10 11
A
B
C
D
E
F
G
H
J
K
L
68-Pin GB Package
(Top View)
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