
SN54LV04A, SN74LV04A
HEX INVERTERS
SCLS388J SEPTEMBER 1997 REVISED APRIL 2005
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D 2-V to 5.5-V V
CC Operation
D Max t
pd of 6.5 ns at 5 V
D Latch-Up Performance Exceeds 250 mA Per
JESD 17
D Typical V
OLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
D Typical V
OHV (Output VOH Undershoot)
>2.3 V at VCC = 3.3 V, TA = 25°C
D Support Mixed-Mode Voltage Operation on
All Ports
D I
off Supports Partial-Power-Down Mode
Operation
D ESD Protection Exceeds JESD 22
2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
1000-V Charged-Device Model (C101)
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1A
1Y
2A
2Y
3A
3Y
GND
VCC
6A
6Y
5A
5Y
4A
4Y
SN54LV04A ...J OR W PACKAGE
SN74LV04A ...D, DB, DGV, NS,
OR PW PACKAGE
(TOP VIEW)
32 1 20 19
910 11 1213
4
5
6
7
8
18
17
16
15
14
6Y
NC
5A
NC
5Y
2A
NC
2Y
NC
3A
1Y
1A
NC
4Y
4A
V
6A
3Y
GND
NC
SN54LV04A . . . FK PACKAGE
(TOP VIEW)
CC
NC No internal connection
SN74LV04A . . . RGY PACKAGE
(TOP VIEW)
114
78
2
3
4
5
6
13
12
11
10
9
6A
6Y
5A
5Y
4A
1Y
2A
2Y
3A
3Y
1A
4Y
V
GND
CC
description/ordering information
These hex inverters are designed for 2-V to 5.5-V VCC operation. The ’LV04A devices contain six independent
inverters. These devices perform the Boolean function Y = A.
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow through the devices when they are powered down.
ORDERING INFORMATION
TA
PACKAGE
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
QFN RGY
Reel of 1000
SN74LV04ARGYR
LV04A
SOIC
D
Tube of 50
SN74LV04AD
LV04A
SOIC D
Reel of 2500
SN74LV04ADR
LV04A
SOP NS
Reel of 2000
SN74LV04ANSR
74LV04A
40
°C to 85°C
SSOP DB
Reel of 2000
SN74LV04ADBR
LV04A
40 C to 85 C
Tube of 90
SN74LV04APW
TSSOP PW
Reel of 2000
SN74LV04APWR
LV04A
TSSOP
PW
Reel of 250
SN74LV04APWT
LV04A
TVSOP DGV
Reel of 2000
SN74LV04ADGVR
LV04A
CDIP J
Tube of 25
SNJ54LV04AJ
55
°C to 125°C
CFP W
Tube of 150
SNJ54LV04AW
LCCC FK
Tube of 55
SNJ54LV04AFK
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Copyright
2005, Texas Instruments Incorporated
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.