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參數(shù)資料
型號: TC9402EJD
廠商: Microchip Technology
文件頁數(shù): 21/28頁
文件大小: 545K
描述: IC V-FREQ/FREQ-V CONV 14CDIP
標(biāo)準(zhǔn)包裝: 29
類型: 電壓至頻率和頻率至電壓
頻率 - 最大: 100kHz
全量程: ±100ppm/°C
線性: ±0.25%
安裝類型: 通孔
封裝/外殼: 14-CDIP(0.300",7.62mm)
供應(yīng)商設(shè)備封裝: 14-CERDIP
包裝: 管件
?2007 Microchip Technology Inc.
DS21483D-page 21
TC9400/9401/9402
14-Lead Plastic Small Outline (OD)  Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. ?Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC:Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:  For the most current package drawings, please see the Microchip Packaging Specification located at 
http://www.microchip.com/packaging
Units
MILLIMETERS
Dimension Limits   MIN
NOM
MAX
Number of Pins
N
14
Pitch
e
1.27 BSC
Overall Height
A


1.75
Molded Package Thickness
A2    1.25


Standoff ?/DIV>
A1    0.10

0.25
Overall Width
E
6.00 BSC
Molded Package Width
E1
3.90 BSC
Overall Length
D
8.65 BSC
Chamfer (optional)
h    0.25

0.50
Foot Length
L    0.40

1.27
Footprint
L1
1.04 REF
Foot Angle
?/DIV>
0?/DIV>

8?/DIV>
Lead Thickness
c    0.17

0.25
Lead Width
b    0.31

0.51
Mold Draft Angle Top
?/DIV>
5?/DIV>

15?/DIV>
Mold Draft Angle Bottom
?/DIV>
5?/DIV>

15?/DIV>
NOTE 1
N
D
E
E1
1
2  3
b
e
A
A1
A2
L
L1
c
h
h
?/DIV>
?/DIV>
?/DIV>
MicrochipTechnologyDrawingC04-065B
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