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參數資料
型號: TLGE18CPF
廠商: Toshiba Corporation
英文描述: Panel Circuit Indicator
中文描述: 面板電路指標
文件頁數: 1/3頁
文件大小: 243K
代理商: TLGE18CPF
TLGE18CP(F)
2007-10-01
1
TOSHIBA InGaA
P LED
TLGE18CP(F)
Panel Circuit Indicator
Lead(Pb)-free products (lead: Sn-Ag-Cu)
5 mm package wide viewing angle
InGaA
P
Emitted color: green
Colored, Transparent lens
Applications: Various types of information panels, indicators for
amusement
equipment
illumination sources.
Stopper lead type is also available.
TLGE18C(F)
Lineup
and
panel
backlighting
Product Name
Color
Material
TLGE18CP(F)
Green
P
InGaA
l
Absolute Maximum Ratings
(Ta
=
25°C)
Product Name
Forward Current
I
F
(mA)
Reverse Voltage
V
R
(V)
Power Dissipation
P
D
(mW)
Operating
Temperature
T
opr
(°C)
Storage
Temperature
Tstg (°C)
TLGE18CP(F)
50
4
120
40~100
40~120
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical and Optical Characteristics
(Ta
=
25°C)
Emission Wavelength
Luminous Intensity
I
V
Forward Voltage
V
F
Reverse
Current
I
R
λ
d
λ
P
Δλ
Product
Name
Min
Typ
Max
Typ
Typ
IF
Min
Typ
IF
Typ
Max
IF
Max
V
R
TLGE18CP(F)
Unit
565
571
576
nm
574
20
20
mA
153
500
mcd
20
2.0
2.4
20
50
μ
A
4
V
V
mA
Note:
Lamps are classified into the following ranks according to their luminous intensity. Each packing box includes
single Luminous Intensity class.
I
V
P:153-414mcd, Q: 272-736mcd,R:476mcd -
λ
d
1: 565-573nm, 2: 569-576nm
Precautions
Please be careful of the following:
Soldering temperature: 260°C max, soldering time: 3 s max
(soldering portion of lead: up to 1.6 mm from the body of the device)
If the lead is formed, the lead should be formed up to 1.6 mm from the body of the device without forming stress
to the resin. Soldering should be performed after lead forming.
This visible LED lamp also emits some IR light.
If a photo detector is located near the LED lamp, please ensure that it will not be affected by this IR light
Unit: mm
JEDEC
JEITA
TOSHIBA
4-5AN2
Weight: 0.31 g(Typ.)
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