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參數資料
| 型號： | TLV5610IYER |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | DAC |
| 英文描述： | SERIAL INPUT LOADING, 3 us SETTLING TIME, 12-BIT DAC, PBGA20 |
| 封裝： | WAFER CHIP SCALE, 20 PIN |
| 文件頁數： | 5/17頁 |
| 文件大小： | 345K |
| 代理商： | TLV5610IYER |
TLV5610IYE
TLV5608IYE
SLAS393 OCTOBER 2003
www.ti.com
13
USING TLV5610IYE AND TLV5608IYE, WAFER CHIP SCALE PACKAGE (WCS)
D TLV5610 and TLV5608 qualifications were done using a wire-bonded small outline (SOIC) package and
includes: steady state life, thermal shock, ESD, latch-up, biased HAST, autoclave, and characterization.
These qualified devices are orderable as TLV5610IDW and TLV5608IDW.
D The wafer chip-scale package (WCS), TLV5610IYE and TLV5608IYE, uses the same DIE as
TLV5610IDW and TLV5608IDW respectively, but are not qualified. WCS qualification, including board
level reliability (BLR), is the responsibility of the customer.
D It is recommended that underfill be used for increased reliability. BLR is application dependent, but may
include test such as: temperature cycling, drop test, key push, bend, vibration, and package shear.
The following WCSP information provides the user of the TLV5610IYE and TLV5608IYE with some general
guidelines for board assembly.
D Melting point of eutectic solder is 183°C.
D Recommended peak reflow temperatures are in the 220°C to 230°C range.
D The use of underfill is required. The use of underfill greatly reduces the risk of thermal mismatch fails.
Underfill is an epoxy/adhesive that may be added during the board assembly process to improve board
level/system level reliability. The process is to dispense the epoxy under the dice after die attach reflow. The
epoxy adheres to the body of the device and to the printed-circuit board. It reduces stress placed upon the solder
joints due to the thermal coefficient of expansion (TCE) mismatch between the board and the component.
Underfill material is highly filled with silica or other fillers to increase an epoxy’s modulus, reduce creep
sensitivity, and decrease the material’s TCE.
The recommendation for peak flow temperatures of 220
°C to 230°C is based on general empirical results that
indicate that this temperature range is needed to facilitate good wetting of the solder bump to the substrate or
circuit board pad. Lower peak temperatures may cause nonwets (cold solder joints).
Bottom View
Top View
NOTES:A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
Figure 11. TLV5610IYE and TLV5608IYE Wafer Chip Scale Package
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相關代理商/技術參數 |
參數描述 |
|---|---|
| TLV5610IYZ | 制造商:TI 制造商全稱:Texas Instruments 功能描述:DIGITAL-TO-ANALOG CONVERTER in a Wafer Chip-Scale Packagea??Pb-Free/Green |
| TLV5610IYZR | 功能描述:數模轉換器- DAC 2.7V to 5.5V 12B Octal DAC RoHS:否 制造商:Texas Instruments 轉換器數量:1 DAC 輸出端數量:1 轉換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩定時間:1 us 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| TLV5610IYZT | 功能描述:數模轉換器- DAC 2.7V to 5.5V 12B Octal DAC RoHS:否 制造商:Texas Instruments 轉換器數量:1 DAC 輸出端數量:1 轉換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩定時間:1 us 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| TLV5613 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:2.7 V TO 5.5 V 12-BIT PARALLEL DIGITAL-TO-ANALOG CONVERTER WITH POWER DOWN |
| TLV5613CDW | 功能描述:數模轉換器- DAC 12bit CMOS DAC RoHS:否 制造商:Texas Instruments 轉換器數量:1 DAC 輸出端數量:1 轉換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩定時間:1 us 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
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