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參數資料
型號: TLV5613IPWRG4
廠商: TEXAS INSTRUMENTS INC
元件分類: DAC
英文描述: PARALLEL, WORD INPUT LOADING, 3.5 us SETTLING TIME, 12-BIT DAC, PDSO20
封裝: GREEN, PLASTIC, TSSOP-20
文件頁數: 11/23頁
文件大小: 447K
代理商: TLV5613IPWRG4
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
TLV5613CDW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV5613CDWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV5613CPW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV5613CPWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV5613IDW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV5613IDWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV5613IDWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV5613IDWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV5613IPW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV5613IPWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV5613IPWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV5613IPWRG4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com
28-Aug-2008
Addendum-Page 1
相關PDF資料
PDF描述
TLV5613CDW PARALLEL, WORD INPUT LOADING, 1 us SETTLING TIME, 12-BIT DAC, PDSO20
TLV5613CPWR PARALLEL, WORD INPUT LOADING, 1 us SETTLING TIME, 12-BIT DAC, PDSO20
TLV5613IPW PARALLEL, WORD INPUT LOADING, 1 us SETTLING TIME, 12-BIT DAC, PDSO20
TLV5613CPW PARALLEL, WORD INPUT LOADING, 1 us SETTLING TIME, 12-BIT DAC, PDSO20
TLV5613CDWR PARALLEL, WORD INPUT LOADING, 1 us SETTLING TIME, 12-BIT DAC, PDSO20
相關代理商/技術參數
參數描述
TLV5613PW 制造商:TI 制造商全稱:Texas Instruments 功能描述:2.7 V TO 5.5 V 12-BIT PARALLEL DIGITAL-TO-ANALOG CONVERTER WITH POWER DOWN
TLV5614 制造商:TI 制造商全稱:Texas Instruments 功能描述:2.7-V TO 5.5-V 12-BIT 3-mS QUADRUPLE DIGITAL-TO-ANALOG CONVERTERS WITH POWER DOWN
TLV5614-10-30EVM 功能描述:數據轉換 IC 開發工具 TLV5614-10-30 Eval Mod RoHS:否 制造商:Texas Instruments 產品:Demonstration Kits 類型:ADC 工具用于評估:ADS130E08 接口類型:SPI 工作電源電壓:- 6 V to + 6 V
TLV5614CD 功能描述:數模轉換器- DAC 10bit Quad Serial RoHS:否 制造商:Texas Instruments 轉換器數量:1 DAC 輸出端數量:1 轉換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩定時間:1 us 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube
TLV5614CDG4 功能描述:數模轉換器- DAC 10bit Quad Serial RoHS:否 制造商:Texas Instruments 轉換器數量:1 DAC 輸出端數量:1 轉換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩定時間:1 us 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube
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