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參數資料
| 型號： | TLV5614IYZR |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | DAC |
| 英文描述： | SERIAL INPUT LOADING, 9 us SETTLING TIME, 12-BIT DAC, UUC16 |
| 封裝： | GREEN, DIE-16 |
| 文件頁數： | 14/25頁 |
| 文件大小： | 500K |
| 代理商： | TLV5614IYZR |
www.ti.com
USING THE TLV5614IYZ WAFER CHIP-SCALE PACKAGE (WCSP)
TopView
BottomView
NOTES: A. All lineardimensionsareinmillimeters.
B. Thisdrawingissubjecttochangewithoutnotice.
SBAS401 – DECEMBER 2006
TLV5614 qualifications are done using a wire-bonded small outline (SO) package. The qualifications include:
steady state life, thermal shock, ESD, latch-up, biased HAST, autoclave, and characterization. These qualified
devices are orderable as TLV5614IDW.
NOTE: The wafer chip-scale package (WCSP) for the TLV5614IYZ uses the same die as TLV5614IDW, but is
not qualified. WCSP qualification, including board level reliability (BLR), is the responsibility of the customer.
It is recommended that underfill be used for increased reliability. BLR is application-dependent, but may include
tests such as: temperature cycling, drop test, key push, bend, vibration, and package shear.
For general guidelines on board assembly of the WCSP, the following documentation provides more details:
Application Report NanoStar & NanoFree 300m Solder Bump WCSP Application—SBVA017
Design Summary WCSP Little Logic—SCET007B
NOTE: The use of underfill is required and greatly reduces the risk of thermal mismatch fails.
Underfill is an epoxy/adhesive that may be added during the board assembly process to improve board
level/system level reliability. The process of underfilling is to dispense the epoxy under the device after die
attach reflow. The epoxy adheres to the body of the device and to the printed circuit board (PCB). It reduces
stress placed upon the solder joints as a result of the thermal coefficient of expansion (TCE) mismatch between
the board and the component. Underfill material typically consists of silica or other fillers to increase modulus of
an epoxy, reduce creep sensitivity, and decrease the material TCE.
The recommendation for peak flow temperatures of +220
°C to +230°C is based on general empirical results that
indicate that this temperature range is needed to facilitate good wetting of the solder bump to the substrate or
PCB. Lower peak temperatures may cause nonwets (cold solder joints).
Figure 19. TLV5614IYZ Bumped Die Package
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| TLV5614IYZT | SERIAL INPUT LOADING, 9 us SETTLING TIME, 12-BIT DAC, UUC16 |
| TLV5614MPWREP | SERIAL INPUT LOADING, 9 us SETTLING TIME, 12-BIT DAC, PDSO16 |
| TLV5616CDGKRG4 | SERIAL INPUT LOADING, 9 us SETTLING TIME, 12-BIT DAC, PDSO8 |
| TLV5616CDR | SERIAL INPUT LOADING, 9 us SETTLING TIME, 12-BIT DAC, PDSO8 |
| TLV5616CD | SERIAL INPUT LOADING, 9 us SETTLING TIME, 12-BIT DAC, PDSO8 |
相關代理商/技術參數 |
參數描述 |
|---|---|
| TLV5614IYZT | 功能描述:數模轉換器- DAC 2.7V-5.5V 12B lead free/green DAC RoHS:否 制造商:Texas Instruments 轉換器數量:1 DAC 輸出端數量:1 轉換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩定時間:1 us 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| TLV5614MPWREP | 功能描述:數模轉換器- DAC Mil Enhance Quad DAC Ser In Lo-pwr RoHS:否 制造商:Texas Instruments 轉換器數量:1 DAC 輸出端數量:1 轉換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩定時間:1 us 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| TLV5614PW | 制造商:TI 制造商全稱:Texas Instruments 功能描述:2.7-V TO 5.5-V 12-BIT 3-mS QUADRUPLE DIGITAL-TO-ANALOG CONVERTERS WITH POWER DOWN |
| TLV5614Y | 制造商:TI 制造商全稱:Texas Instruments 功能描述:2.7-V TO 5.5-V, 12-BIT QUAD DAC IN WAFER CHIP SCALE PACKAGE |
| TLV5616 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:2.7 V TO 5.5 V LOW POWER 12-BIT DIGITAL-TO-ANALOG CONVERTERS WITH POWER DOWN |
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