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參數資料
| 型號： | TMDS261BPAGR |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 消費家電 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, PQFP64 |
| 封裝： | GREEN, PLASTIC, TQFP-64 |
| 文件頁數： | 4/49頁 |
| 文件大小： | 11321K |
| 代理商： | TMDS261BPAGR |
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TMDS DDC and Local I
2C Pins
ELECTRICAL CHARACTERISTICS
SLLS987 – SEPTEMBER 2009 .......................................................................................................................................................................................... www.ti.com
DDC I2C Buffer or Repeater: The TMDS261B provides buffering on the DDC I2C interface for each of the input
ports connected. This feature isolates the capacitance on the source side from the sink side and thus helps in
passing system-level compliance. See the DDC I2C Function Description section for a detailed description on
how the DDC I2C buffer operates. Note that a key requirement on the sink side is that the VIL(Sink) (input to
TMDS261B) should be less than 0.4 V. This requirement should be met for the DDC I2C buffer to function
properly. There are three settings of VIL(Sink) and VOL(Sink) that can be chosen based on OVS settings (See Table 8
through Table 11).
Local I2C Interface: The TMDS261B includes a slave I2C interface to control device features like TMDS input
port selection, TMDS output edge-rate control, power management, DDC buffer OVS settings, etc. See Table 8
through Table 11.
The TMDS261B is designed to be controlled via a local I2C interface or GPIO interface, based on the status of
the I2C_SEL pin. The local I2C interface in the TMDS261B is only a slave I2C interface. See the I2C INTERFACE
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
IL
Low-level input current
VCC = 3.6 V, VI = 0 V
–10
10
A
Ilkg(Sink)
Input leakage current
Sink pins
VCC = 3.6 V, VI = 4.95 V
–10
10
A
CIO(Sink)
Input/output capacitance
Sink pins
DC bias = 2.5 V, ac = 3.5 Vp-p, f = 100 kHz
15
pF
VIH(Sink)
High-level input voltage
Sink pins
2.1
5.5
V
VIL1(Sink)
Low-level input voltage
Sink pins
OVS 1
–0.2
0.4
V
VOL1(Sink)
Low-level output voltage
Sink pins
IO = 3 mA, OVS = HIGH
0.6
0.7
V
VIL2(Sink)
Low-level input voltage
Sink pins
OVS 2
–0.2
0.4
V
VOL2(Sink)
Low-level output voltage
Sink pins
IO = 3 mA, OVS = LOW
0.5
0.6
V
VIL3(Sink)
Low-level input voltage
Sink pins
OVS 3
–0.2
0.3
V
VOL3(Sink)
Low-level output voltage
Sink pins
IO = 3 mA, OVS = high-Z
0.4
0.5
V
Ilkg(I2C)
Input leakage current
Port[1:2] pins
VCC = 3.6 V, VI = 4.95 V
–10
10
A
CIO(I2C)
Input/output capacitance
Port[1:2] pins
DC bias = 2.5 V, ac = 3.5 Vp-p, f = 100 kHz
15
pF
VIH(I2C)
High-level input voltage
Port[1:2] pins
2.1
5.5
V
VIL(I2C)
Low-level input voltage
Port[1:2] pins
–0.2
1.5
V
VOL(I2C)
Low-level output voltage
Port[1:2] pins
IO = 3 mA
0.2
V
12
Copyright 2009, Texas Instruments Incorporated
Product Folder Link(s) :TMDS261B
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