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參數資料
| 型號： | TPA2015D1YZHT |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 1.7 W, 1 CHANNEL, AUDIO AMPLIFIER, BGA16 |
| 封裝： | 1.954 X 1.954 MM, 0.50 MM PITCH, DSBGA-16 |
| 文件頁數： | 15/27頁 |
| 文件大?。?/td> | 1016K |
| 代理商： | TPA2015D1YZHT |
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Copper
Trace Width
Solder Mask
Thickness
Solder
Pad Width
Solder Mask
Opening
Copper Trace
Thickness
SLOS638 – MAY 2010
www.ti.com
BOARD LAYOUT
In making the pad size for the WCSP balls, it is recommended that the layout use nonsolder mask defined
(NSMD) land.
With this method, the solder mask opening is made larger than the desired land area, and the opening size is
defined by the copper pad width. Figure 28 and Table 5 show the appropriate diameters for a WCSP layout.
Figure 28. Land Pattern Dimensions
Table 5. Land Pattern Dimensions(1) (2) (3) (4)
SOLDER PAD
COPPER
SOLDER MASK (5)
COPPER
STENCIL (6) (7)
STENCIL
DEFINITIONS
PAD
OPENING
THICKNESS
OPENING
THICKNESS
Nonsolder mask
275 mm
275 mm x 275 mm Sq.
375 mm (+0.0, -25 mm)
1 oz max (32 mm)
125 mm thick
defined (NSMD)
(+0.0, -25 mm)
(rounded corners)
(1)
Circuit traces from NSMD defined PWB lands should be 75 mm to 100 mm wide in the exposed area inside the solder mask opening.
Wider trace widths reduce device stand off and impact reliability.
(2)
Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the
intended application.
(3)
Recommend solder paste is Type 3 or Type 4.
(4)
For a PWB using a Ni/Au surface finish, the gold thickness should be less 0.5 mm to avoid a reduction in thermal fatigue performance.
(5)
Solder mask thickness should be less than 20 mm on top of the copper circuit pattern
(6)
Best solder stencil performance is achieved using laser cut stencils with electro polishing. Use of chemically etched stencils results in
inferior solder paste volume control.
(7)
Trace routing away from WCSP device should be balanced in X and Y directions to avoid unintentional component movement due to
solder wetting forces.
TRACE WIDTH
Recommended trace width at the solder balls is 75 mm to 100 mm to prevent solder wicking onto wider PCB
traces. For high current pins (SW, GND, OUT+, OUT–, PVOUT, and PVDD) of the TPA2015D1, use 100 mm
trace widths at the solder balls and at least 500 mm PCB traces to ensure proper performance and output power
for the device. For low current pins (IN–, IN+, END, ENB, GAIN, AGC, VBAT) of the TPA2015D1, use 75 mm to
100 mm trace widths at the solder balls. Run IN- and IN+ traces side-by-side (and if possible, same length) to
maximize common-mode noise cancellation.
22
Copyright 2010, Texas Instruments Incorporated
Product Folder Link(s): TPA2015D1
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