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參數資料
| 型號： | TPA6203AIDGN |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 1.25 W, 1 CHANNEL, AUDIO AMPLIFIER, PDSO8 |
| 封裝： | POWERPAD, MSOP-8 |
| 文件頁數： | 6/22頁 |
| 文件大小： | 1054K |
| 代理商： | TPA6203AIDGN |
www.ti.com
PCB LAYOUT
C1
C2
C3
B1
B3
A1
A3
0.25 mm
0.28 mm
0.38 mm
Solder Mask
Paste Mask (Stencil)
Copper Trace
B2
VIAS to Ground Plane
TPA6203A1
SLOS364D – MARCH 2002 – REVISED JULY 2005
Table 2 shows that for most applications no airflow is
laminate. Increased copper also increases the ther-
required to keep junction temperatures in the speci-
mal performance of the IC. Better size control is the
fied range. The TPA6203A1 is designed with thermal
result of photo imaging the stencils for masks. Small
protection that turns the device off when the junction
plated vias should be placed near the center ball
temperature surpasses 150
°C to prevent damage to
connecting ball B2 to the ground plane. Added plated
the IC. Also, using more resistive than 8-
speakers
vias and ground plane act as a heatsink and increase
dramatically increases the thermal performance by
the thermal performance of the device. Figure 34
reducing the output current.
shows the appropriate diameters for a 2 mm X 2 mm
MicroStar Junior BGA layout.
It is very important to keep the TPA6203A1 external
components very close to the TPA6203A1 to limit
In making the pad size for the BGA balls, it is
noise pickup. The TPA6203A1 evaluation module
recommended
that
the
layout
use
solder-
(EVM) layout is shown in the next section as a layout
mask-defined (SMD) land. With this method, the
example.
copper pad is made larger than the desired land area,
and the opening size is defined by the opening in the
solder mask material. The advantages normally as-
sociated with this technique include more closely
controlled size and better copper adhesion to the
Figure 34. MicroStar Junior BGA Recommended Layout
14
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| TPA6203AIDRB | 1.25 W, 1 CHANNEL, AUDIO AMPLIFIER, PDSO8 |
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| TPA6205A1DRBR | 1.25 W, 1 CHANNEL, AUDIO AMPLIFIER, PDSO8 |
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相關代理商/技術參數 |
參數描述 |
|---|---|
| TPA6204A1 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:1.7W MONO FULLY DIFFERENTIAL AUDIO POWER AMPLIFIER |
| TPA6204A1_07 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:1.7W MONO FULLY DIFFERENTIAL AUDIO POWER AMPLIFIER |
| TPA6204A1DGN | 制造商:TI 制造商全稱:Texas Instruments 功能描述:1.7W MONO FULLY DIFFERENTIAL AUDIO POWER AMPLIFIER |
| TPA6204A1DRB | 功能描述:音頻放大器 1.7-W Mono Full Diff Aud Power Amplifier RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TPA6204A1DRB | 制造商:Texas Instruments 功能描述:AUDIO POWER AMPLIFIER IC 制造商:Texas Instruments 功能描述:IC, AUDIO PWR AMP, CLASS AB, 1.7W, SON-8 |
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