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參數資料
型號: TPA751GQS
廠商: Texas Instruments, Inc.
元件分類: 音頻放大器
英文描述: 700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER WITH DIFFERENTIAL INPUTS
中文描述: 700兆瓦的單聲道低壓音頻功率放大器,具有差分輸入
文件頁數: 1/23頁
文件大小: 362K
代理商: TPA751GQS
TPA751
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER
WITH DIFFERENTIAL INPUTS
SLOS336C – DECEMBER 2000 – REVISED OCTOBER 2002
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
Fully Specified for 3.3-V and 5-V Operation
Wide Power Supply Compatibility
2.5 V – 5.5 V
Power Supply Rejection at 217 Hz
– 84 dB at V
DD
= 5 V
– 81 dB at V
DD
= 3.3 V
Output Power for R
L
= 8
– 700 mW at V
DD
= 5 V
– 250 mW at V
DD
= 3.3 V
Ultralow Supply Current in Shutdown
Mode . . . 1.5 nA
Thermal and Short-Circuit Protection
Surface-Mount Packaging
– SOIC
– PowerPAD
MSOP
– MicroStar Junior
(BGA)
description
The TPA751 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications
where internal speakers are required. Operating with a 3.3-V supply, the TPA751 can deliver 250-mW of
continuous power into a BTL 8-
load at less than 0.6% THD+N throughout voice band frequencies. Although
this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as
wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the
output in most applications, which is particularly important for small battery-powered equipment. This device
features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown.
The TPA751 is available in a 3.0
×
3.0 mm MicroStar Junior
(BGA), 8-pin SOIC surface-mount package and
a surface-mount PowerPAD
MSOP.
Audio
Input
Bias
Control
VDD
700 mW
6
5
7
VO+
VDD
1
2
4
BYPASS
IN –
VDD/2
CI
RI
CS
CB
RF
SHUTDOWN
VO–
8
GND
From System Control
3
IN+
+
+
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright
2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
2
3
4
8
7
6
5
SHUTDOWN
BYPASS
IN+
IN–
V
O
GND
V
DD
V
O
+
D OR DGN PACKAGE
(TOP VIEW)
(SIDE VIEW)
MicroStar Junior (GQS) Package
(TOP VIEW)
SHUTDOWN
BYPASS
VO–
GND
VDD
VO+
IN+
IN–
NOTE: The shaded terminals are used for thermal
connections to the ground plane.
(E2
)
(
E3
)
(
E4
)
(
E5
)
(
A2
)
(
A3
)
(
A4
)
(
A5
)
PowerPAD and MicroStar Junior are trademarks of Texas Instruments.
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相關代理商/技術參數
參數描述
TPA751GQSR 功能描述:音頻放大器 Mono Diff Input Class-AB RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TPA77930DGK 制造商:Rochester Electronics LLC 功能描述:- Bulk
TPA-B-20 功能描述:保險絲 TELPOWER ALARM FUSE RoHS:否 制造商:Littelfuse 產品:Surface Mount Fuses 電流額定值:0.5 A 電壓額定值:600 V 保險絲類型:Fast Acting 保險絲大小/組:Nano 尺寸:12.1 mm L x 4.5 mm W 安裝風格: 端接類型:SMD/SMT 系列:485
TPA-B-25 功能描述:保險絲 TELPOWER ALARM FUSE RoHS:否 制造商:Littelfuse 產品:Surface Mount Fuses 電流額定值:0.5 A 電壓額定值:600 V 保險絲類型:Fast Acting 保險絲大小/組:Nano 尺寸:12.1 mm L x 4.5 mm W 安裝風格: 端接類型:SMD/SMT 系列:485
TPA-B-30 功能描述:保險絲 TELPOWER ALARM FUSE RoHS:否 制造商:Littelfuse 產品:Surface Mount Fuses 電流額定值:0.5 A 電壓額定值:600 V 保險絲類型:Fast Acting 保險絲大小/組:Nano 尺寸:12.1 mm L x 4.5 mm W 安裝風格: 端接類型:SMD/SMT 系列:485
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