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參數(shù)資料
| 型號(hào)： | TPS1101Y |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | CONNECTOR ACCESSORY |
| 中文描述： | 連接器附件 |
| 文件頁數(shù)： | 2/10頁 |
| 文件大?。?/td> | 161K |
| 代理商： | TPS1101Y |
TPS1101, TPS1101Y
SINGLE P-CHANNEL ENHANCEMENT-MODE MOSFETS
SLVS079C – DECEMBER 1993 – REVISED AUGUST 1995
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
schematic
NOTE A: For all applications, all source terminals should be
connected and all drain terminals should be connected.
SOURCE
DRAIN
GATE
ESD-
Protection
Circuitry
TPS1101Y chip information
This chip, when properly assembled, displays characteristics similar to the TPS1101. Thermal compression or
ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4
×
4 MILS MINIMUM
TJmax = 150
°
C
TOLERANCES ARE
±
10%
ALL DIMENSIONS ARE IN MILS
80
92
TPS1100Y
(2)
(6)
(1)
(3)
(7)
(8)
(5)
(4)
DRAIN
SOURCE
SOURCE
SOURCE
GATE
DRAIN
DRAIN
DRAIN
(2)
(1)
(3)
(4)
(6)
(7)
(8)
(5)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TPS1101YDW | CONNECTOR ACCESSORY |
| TPS1120YD | CONNECTOR ACCESSORY |
| TPS1120Y | CONNECTOR ACCESSORY |
| TPS2010APWP | CONNECTOR ACCESSORY |
| TPS2012APWP | POWER-DISTRIBUTION SWITCHES |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TPS1101YDW | 制造商:TI 制造商全稱:Texas Instruments 功能描述:SINGLE P-CHANNEL ENHANCEMENT-MODE MOSFETS |
| TPS1101YPW | 制造商:TI 制造商全稱:Texas Instruments 功能描述:SINGLE P-CHANNEL ENHANCEMENT-MODE MOSFETS |
| TPS111 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Analog IC |
| TPS1110 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Single P-Channel Logic-Level Mosfets |
| TPS1110D | 制造商:TI 制造商全稱:Texas Instruments 功能描述:SINGLE P-CHANNEL LOGIC-LEVEL MOSFETS |
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