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參數資料
| 型號： | TPS40054QPWPRQ1 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 穩壓器 |
| 英文描述： | SWITCHING CONTROLLER, 1000 kHz SWITCHING FREQ-MAX, PDSO16 |
| 封裝： | PLASTIC, HTSSOP-16 |
| 文件頁數： | 14/28頁 |
| 文件大小： | 571K |
| 代理商： | TPS40054QPWPRQ1 |
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P
SR + PDC ) PRR ) PCOND
(Watts)
(39)
TPS4005x POWER DISSIPATION
P
D + Qg
V
DR
f
SW
(Watts driver)
(40)
P
T +
2
P
D
V
DR
) IQ
V
IN
(Watts)
(41)
P
T + 2
Qg
f
SW ) IQ
V
IN
(Watts)
(42)
q
JA + 36.515
O
C W
(43)
P
T +
T
J * TA
q
JA
(Watts)
(44)
f
SW +
T
J*TA
q
JA
V
DD
* IQ
2
Qg
(Hz)
(45)
LAYOUT CONSIDERATIONS
PowerPAD PACKAGE
TPS40054-Q1, TPS40055-Q1, TPS40057-Q1
SLAS482A – AUGUST 2005 – REVISED NOVEMBER 2005
APPLICATION INFORMATION (continued)
The power dissipation in the TPS4005x is largely dependent on the MOSFET driver currents and the input
voltage. The driver current is proportional to the total gate charge, Qg, of the external MOSFETs. Driver power
(neglecting external gate resistance, refer to [2] can be calculated from Equation 40.
And the total power dissipation in the TPS4005x, assuming the same MOSFET is selected for both the high-side
and synchronous rectifier is described in Equation 41.
or
where:
I
Q is the quiescent operating current (neglecting drivers)
The maximum power capability of the device's PowerPad package is dependent on the layout as well as air flow.
The thermal impedance from junction to air, assuming 2 oz. copper trace and thermal pad with solder and no air
flow.
The maximum allowable package power dissipation is related to ambient temperature by Equation 44.
Substituting Equation 45 into Equation 41 and solving for fSW yields the maximum operating frequency for the
TPS4005x. The result is described in Equation 45.
The PowerPAD package provides low thermal impedance for heat removal from the device. The PowerPAD
derives its name and low thermal impedance from the large bonding pad on the bottom of the device. For
maximum thermal performance, the circuit board must have an area of solder-tinned-copper underneath the
package. The dimensions of this area depends on the size of the PowerPAD package. For a 16-pin TSSOP
(PWP) package, dimensions of the circuit board pad area are 5 mm x 3,4 mm [2]. The dimensions of the package
pad are shown in Figure 16.
Thermal vias connect this area to internal or external copper planes and should have a drill diameter sufficiently
small so that the via hole is effectively plugged when the barrel of the via is plated with copper. This plug is
needed to prevent wicking the solder away from the interface between the package body and the solder-tinned
area under the device during solder reflow. Drill diameters of 0,33 mm (13 mils) works well when 1-oz copper is
plated at the surface of the board while simultaneously plating the barrel of the via. If the thermal vias are not
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