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參數資料
| 型號： | TPS40055MPWPREPG4 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 穩壓器 |
| 英文描述： | SWITCHING CONTROLLER, 1000 kHz SWITCHING FREQ-MAX, PDSO16 |
| 封裝： | PLASTIC, HTSSOP-16 |
| 文件頁數： | 14/35頁 |
| 文件大小： | 2348K |
| 代理商： | TPS40055MPWPREPG4 |
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SGLS310B – JULY 2005 – REVISED OCTOBER 2010
needed to prevent wicking the solder away from the interface between the package body and the solder-tinned
area under the device during solder reflow. Drill diameters of 0,33 mm (13 mils) works well when 1-oz copper is
plated at the surface of the board while simultaneously plating the barrel of the via. If the thermal vias are not
plugged when the copper plating is performed, then a solder mask material should be used to cap the vias with a
diameter equal to the via diameter of 0,1 mm minimum. This capping prevents the solder from being wicked
through the thermal vias and potentially creating a solder void under the package. See the PowerPAD Thermally
Enhanced Package and the mechanical illustration at the end of this document for more information on the
PowerPAD package.
Figure 16. PowerPAD Dimensions
MOSFET PACKAGING
MOSFET package selection depends on MOSFET power dissipation and the projected operating conditions. In
general, for a surface-mount applications, the DPAK style package provides the lowest thermal impedance (qJA)
and, therefore, the highest power dissipation capability. However, the effectiveness of the DPAK depends on
proper layout and thermal management. The qJA specified in the MOSFET data sheet refers to a given copper
area and thickness. In most cases, a lowest thermal impedance of 40°C/W requires one square inch of 2-ounce
copper on a G-10/FR-4 board. Lower thermal impedances can be achieved at the expense of board area. See
the selected MOSFET's data sheet for more information regarding proper mounting.
GROUNDING AND CIRCUIT LAYOUT CONSIDERATIONS
The TPS40055 provides separate signal ground (SGND) and power ground (PGND) pins. It is important that
circuit grounds are properly separated. Each ground should consist of a plane to minimize its impedance if
possible. The high power noisy circuits such as the output, synchronous rectifier, MOSFET driver decoupling
capacitor (BP10), and the input capacitor should be connected to PGND plane at the input capacitor.
Sensitive nodes such as the FB resistor divider RT) and ILIM should be connected to the SGND plane. The
SGND plane should only make a single point connection to the PGND plane.
Component placement should ensure that bypass capacitors (BP10 and BP5) are located as close as possible to
their respective power and ground pins. Also, sensitive circuits such as FB, RT, and ILIM should not be located
near high dv/dt nodes such as HDRV, LDRV, BOOST, and the switch node (SW).
Copyright 2005–2010, Texas Instruments Incorporated
21
Product Folder Link(s): TPS40055-EP
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相關代理商/技術參數 |
參數描述 |
|---|---|
| TPS40055PWP | 功能描述:DC/DC 開關控制器 Wide Input Sync Buck Cntrlr source/sink RoHS:否 制造商:Texas Instruments 輸入電壓:6 V to 100 V 開關頻率: 輸出電壓:1.215 V to 80 V 輸出電流:3.5 A 輸出端數量:1 最大工作溫度:+ 125 C 安裝風格: 封裝 / 箱體:CPAK |
| TPS40055PWPG4 | 功能描述:DC/DC 開關控制器 Wide Input Sync Buck Cntrlr source/sink RoHS:否 制造商:Texas Instruments 輸入電壓:6 V to 100 V 開關頻率: 輸出電壓:1.215 V to 80 V 輸出電流:3.5 A 輸出端數量:1 最大工作溫度:+ 125 C 安裝風格: 封裝 / 箱體:CPAK |
| TPS40055PWPR | 功能描述:DC/DC 開關控制器 Wide Input Sync Buck Cntrlr source/sink RoHS:否 制造商:Texas Instruments 輸入電壓:6 V to 100 V 開關頻率: 輸出電壓:1.215 V to 80 V 輸出電流:3.5 A 輸出端數量:1 最大工作溫度:+ 125 C 安裝風格: 封裝 / 箱體:CPAK |
| TPS40055PWPRG4 | 功能描述:DC/DC 開關控制器 Wide Input Sync Buck Cntrlr source/sink RoHS:否 制造商:Texas Instruments 輸入電壓:6 V to 100 V 開關頻率: 輸出電壓:1.215 V to 80 V 輸出電流:3.5 A 輸出端數量:1 最大工作溫度:+ 125 C 安裝風格: 封裝 / 箱體:CPAK |
| TPS40056 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:WIDE-INPUT SYNCHRONOUS, TRACKING BUCK CONTROLLER |
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