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參數資料
| 型號： | TPS53314RGFR |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 穩壓器 |
| 英文描述： | SWITCHING REGULATOR, 1070 kHz SWITCHING FREQ-MAX, PQCC40 |
| 封裝： | 5 X 7 MM, GREEN, PLASTIC, VQFN-40 |
| 文件頁數： | 12/29頁 |
| 文件大小： | 800K |
| 代理商： | TPS53314RGFR |
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SLUSAK3
– MAY 2011
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION(1)
ORDERING
TRANSPORT
MINIMUM
TA
PACKAGE
PINS
ECO PLAN
NUMBER
MEDIA
QUANTITY
TPS53314RGFR
40
Tape and reel
3000
Plastic QFN
Green (RoHS and
–40°C to 85°C
(RGF)
no Pb/Br)
TPS53314RGFT
40
Mini reel
250
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
VALUE
UNIT
VIN (main supply)
–0.3 to 17
VDD
–0.3 to 28
Input voltage range
VBST
–0.3 to 24
V
VBST(with respect to LL)
–0.3 to 7
EN, TRIP, VFB, RF, MODE
–0.3 to 7
DC
–1 to 23
LL
Pulse
< 20 ns, E = 5 μJ
–7
Output voltage range
V
PGOOD, VREG
–0.3 to 7
PGND
–0.3 to 0.3
Source/Sink Current
VBST
50
mA
Operating free-air temperature, TA
–40 to 85
°C
Storage temperature range, Tstg
–55 to 150
°C
Junction temperature range, TJ
–40 to 150
°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
300
°C
(1)
Stresses beyond those listed under
“absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under
“recommended operating
conditions
” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
TPS53314
THERMAL METRIC(1)
UNITS
RGF(40 PINS)
θJA
Junction-to-ambient thermal resistance
35.8
θJCtop
Junction-to-case (top) thermal resistance
23.8
θJB
Junction-to-board thermal resistance
10.1
°C/W
ψJT
Junction-to-top characterization parameter
0.4
ψJB
Junction-to-board characterization parameter
10.0
θJCbot
Junction-to-case (bottom) thermal resistance
2.8
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
Copyright
2011, Texas Instruments Incorporated
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