- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄98287 > TS12A4516P (TEXAS INSTRUMENTS INC) 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP8 PDF資料下載
參數(shù)資料
| 型號(hào)： | TS12A4516P |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 多路復(fù)用及模擬開(kāi)關(guān) |
| 英文描述： | 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP8 |
| 封裝： | PLASTIC, DIP-8 |
| 文件頁(yè)數(shù)： | 13/13頁(yè) |
| 文件大?。?/td> | 404K |
| 代理商： | TS12A4516P |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)當(dāng)前第13頁(yè)
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
TS12A4516D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS12A4516DG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS12A4516DR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS12A4516DRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS12A4517D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS12A4517DG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS12A4517DR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS12A4517DRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
22-Sep-2008
Addendum-Page 1
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TS2007EIJT | 3 W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA9 |
| TS2007EKIJT | 3 W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA9 |
| TS2007IQT | 2.3 W, 1 CHANNEL, AUDIO AMPLIFIER, DSO8 |
| TS2012EIJT | 2.5 W, 2 CHANNEL, AUDIO AMPLIFIER, PBGA16 |
| TS2012IQT | 2.8 W, 2 CHANNEL, AUDIO AMPLIFIER, PQCC20 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TS12A4517 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:DUAL SUPPLY, LOW ON-STATE RESISTANCE SPST CMOS ANALOG SWITCHES |
| TS12A4517D | 功能描述:模擬開(kāi)關(guān) IC Lo-Vltg Lo On-St Resist SPST CMOS RoHS:否 制造商:Texas Instruments 開(kāi)關(guān)數(shù)量:2 開(kāi)關(guān)配置:SPDT 開(kāi)啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開(kāi)啟時(shí)間（最大值）: 關(guān)閉時(shí)間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
| TS12A4517DBVR | 功能描述:模擬開(kāi)關(guān) IC Lo-Vltg Lo On-State Res SPST CMOS Ana Sw RoHS:否 制造商:Texas Instruments 開(kāi)關(guān)數(shù)量:2 開(kāi)關(guān)配置:SPDT 開(kāi)啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開(kāi)啟時(shí)間（最大值）: 關(guān)閉時(shí)間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
| TS12A4517DG4 | 功能描述:模擬開(kāi)關(guān) IC Lo-Vltg Lo On-St Resist SPST CMOS RoHS:否 制造商:Texas Instruments 開(kāi)關(guān)數(shù)量:2 開(kāi)關(guān)配置:SPDT 開(kāi)啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開(kāi)啟時(shí)間（最大值）: 關(guān)閉時(shí)間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
| TS12A4517DR | 功能描述:模擬開(kāi)關(guān) IC Lo-Vltg Lo On-St Resist SPST CMOS RoHS:否 制造商:Texas Instruments 開(kāi)關(guān)數(shù)量:2 開(kāi)關(guān)配置:SPDT 開(kāi)啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開(kāi)啟時(shí)間（最大值）: 關(guān)閉時(shí)間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。