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參數資料
型號: TS8387MFDSSC/SMD
元件分類: ADC
英文描述: 1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CQFP68
封裝: CERAMIC, QFP-68
文件頁數: 7/38頁
文件大小: 617K
代理商: TS8387MFDSSC/SMD
TS8387
15/38
4.4.
THERMAL CHARACTERISTICS
Although the power dissipation is low for this performance, the use of an heat sink is mandatory.
You will find here below some advise on this topics.
HThermal resistance – junction to ambient
Air flow
ja Thermal resistance
°C/Watt
CQFP 68 on board
Air flow
speed m/s
Estimated
Targeted
No heatsink
With heatsink
24 x 24 x 16 mm
0
50
33
0.5
40
18
1
35
14
1.5
32
12
2
30
11
2.5
28
10
3
26
10
4
24
9
5
23
8
Heatsink glued to backside of package
or pressed with thermal grease
0
10
20
30
40
50
60
01
23
4
5
6
RTH ja estimated value for CQFP68 / without heatsink
+ targeted value CQFP68 with external heatsink
Thermal
resistance
junction
to
air
(degree
C/Watt)
Air flow speed (m/s)
Without Heatsink
24 x 24 x 16 mm heatsink
HThermal resistance – junction to case :
Rthjc = 6
° C/W (typical value).
. . .
相關PDF資料
PDF描述
TS(X)8387CF 1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CQFP68
TS8387MF 1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CQFP68
TS8387CF 1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CQFP68
TS(X)8387CF 1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CQFP68
TS8387CF_ 1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CQFP68
相關代理商/技術參數
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