
TS8387
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3. SPECIFICATIONS
3.1.
ABSOLUTE MAXIMUM RATINGS
(see note below)
Parameter
Symbol
Comments
Value
Unit
Positive Supply Voltage
VCC
GND to 6
V
Digital Negative Supply voltage
DVEE
GND to –5.7
V
Negative supply voltage
VEE
GND to –6
V
Maximum
difference
between
negative supplies
DVEE to VEE
0.3
V
Analog input voltages
VIN or VINB
–1 to +1
V
Maximum difference between VIN
and VINB
VIN –VINB
–1 to +1
V
Digital input voltage
VD
GORB
–0.3 to VCC +0.3
V
Digital output current
IO
Conditions :
–3V<Vout < 0.5 V
20
mA
Clock input voltage
VCLK or VCLKB
–3 to +1.5
V
Maximum
difference
between
VCLK and VCLKB
VCLK – VCLKB
–2 to +2
V
Maximum junction temperature
Tj
+145
°C
Operating temperature (Tc)
Top
–55 to +125
°C
Storage temperature
Tstg
–65 to +150
°C
Lead temperature
(soldering 10 s)
Tleads
+300
°C
Notes : Absolute maximum ratings are limiting values, to be applied individually, while other parameters are within specified operat-
ing conditions. Long exposure to maximum rating may affect device reliability.
The use of a thermal heat sink is mandatory (see Thermal characteristics page 15).
3.2.
RECOMMENDED CONDITIONS OF USE
Parameter
Symbol
Comments
Min.
Typ.
Max.
Unit
Positive supply voltage
VCC
4.75
+5
5.25
V
Negative supplies volt-
ages
VEE, DVEE
–5.25
–5.0
–4.75
V
Differential analog input
voltage (Full Scale)
VIN, VINB
VIN –VINB
50 ohms differential or
single–ended
±125
500
mV
mVpp
Clock input power level
PCLK,
PCLKB
50
W single-ended clock
input
4
10
dBm
Digital Outputs termina-
tion
ZOUT
75
W or 50 W differential output back termination, or unterminated out-
puts : see Advanced Application Notes figures 3,4,5
Operating temperature
range
TJ
Civil : ”C” grade
Industrial : ”V” grade
Military : ”M” grade
0 < Tc < 70
–40 < Tc < 85
–55 < Tc ; Tj < +125
°C