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參數資料
| 型號： | TS8388BMFSB/QNC3 |
| 廠商： | ATMEL CORP |
| 元件分類： | ADC |
| 英文描述： | 1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CQFP68 |
| 封裝： | CERAMIC, QFP-68 |
| 文件頁數： | 6/42頁 |
| 文件大小： | 1307K |
| 代理商： | TS8388BMFSB/QNC3 |
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14
TS8388BFS
Product Specification
4.4. THERMAL CHARACTERISTICS
4.4.1.
ENHANCED CQFP
The CQFP68 has been modified, in order to improve the thermal characteristics :
A CuW heatspreader has been added at the bottom of the package.
The die has been electrically isolated with the ALN substrate.
4.4.2.
THERMAL RESISTANCE FROM JUNCTION TO AMBIENT : RTHJA
The following table lists the convector thermal performances parameters of the device itself, with no external heatsink added.
4.4.3.
THERMAL RESISTANCE FROM JUNCTION TO CASE : RTHJC
Typical value for Rthjc is given to 1.56
oC/W.
This value does not include thermal contact resistance between package and external component (heatsink or PCBoard).
As an example, 2.0
oC/W can be taken for 50 m of thermal grease.
4.4.4.
HEATSINK
It is recommended to use an external heatsink, or PCBoard special design.
The stand off has been calculated to permit the simultaneous soldering of the leads and of the heatspreader with the solder paste.
Suggested assembly :
24.13
28.78
Printed circuit board
CuW heatspreader
Thermal via
Solid ground plane
Cooling system efficiency can be monitored using the Temperature Sensing Diode, integrated in the device.
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