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參數資料
| 型號： | TSA5520 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | 1.3 GHz universal bus-controlled TV synthesizer(1.3 GHz通用總線控制的TV合成器) |
| 中文描述： | 1.3 GHz的通用總線控制的電視頻率合成器（1.3千兆赫通用總線控制的電視合成器） |
| 文件頁數： | 21/24頁 |
| 文件大小： | 285K |
| 代理商： | TSA5520 |
1996 Oct 10
21
Philips Semiconductors
Product specification
1.3 GHz universal bus-controlled
TV synthesizer
TSA5520; TSA5521
SOLDERING SO or SSOP
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
cases reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook”(order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all SO and
SSOP packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from 215 to
250
°
C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45
°
C.
Wave soldering
SO
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow.
The package footprint must incorporate solder thieves at
the downstream end.
SSOP
Wave soldering is
not
recommended for SSOP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
If wave soldering cannot be avoided, the following
conditions must be observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
The longitudinal axis of the package footprint must
be parallel to the solder flow and must incorporate
solder thieves at the downstream end.
Even with these conditions, only consider wave
soldering SSOP packages that have a body width of
4.4 mm, that is SSOP16 (SOT369-1) or
SSOP20 (SOT266-1)
.
M
ETHOD
(SO
OR
SSOP)
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
°
C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
°
C within
6 seconds. Typical dwell time is 4 seconds at 250
°
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
°
C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds at 270 to 320
°
C.
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PDF描述 |
|---|---|
| TSA5521 | 1.3 GHz universal bus-controlled TV synthesizer(1.3 GHz通用總線控制的TV合成器) |
| TSA5520M | 1.3 GHz universal bus-controlled TV synthesizer |
| TSA5520T | Fan Guard; For Use With:120mm Round Tubeaxial Fans; Fixing Centers:4.13"; Thickness:0.148" |
| TSA5521T | 1.3 GHz universal bus-controlled TV synthesizer |
| TSA5522 | 1.4 GHz I2C-bus controlled synthesizer |
相關代理商/技術參數 |
參數描述 |
|---|---|
| TSA5520M | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:1.3 GHz universal bus-controlled TV synthesizer |
| TSA5520T | 制造商:Yageo / Phycomp 功能描述:Frequency Synthesizer, 16 Pin, Plastic, SOP |
| TSA5520TD-T | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:I2C-Bus Frequency Synthesizer |
| TSA5521 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:1.3 GHz universal bus-controlled TV synthesizer |
| TSA5521M | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:1.3 GHz universal bus-controlled TV synthesizer |
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