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參數資料
| 型號： | TSDC05IJT |
| 廠商： | STMICROELECTRONICS |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 1.2 W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA9 |
| 封裝： | LEAD FREE, FCP-9 |
| 文件頁數： | 18/32頁 |
| 文件大小： | 714K |
| 代理商： | TSDC05IJT |
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TS4990
Package information
25/32
Figure 67.
Package mechanical data for 9-bump flip-chip package
Figure 68.
Daisy chain mechanical data
The daisy chain sample features two-by-two pin connections. The schematics in Figure 68
illustrate the way pins connect to each other. This sample is used to test continuity on your
board. Your PCB needs to be designed the opposite way, so that pins that are unconnected
in the daisy chain sample, are connected on your PCB. If you do this, by simply connecting
an Ohmmeter between pin A1 and pin A3, the soldering process continuity can be tested.
■ Die size: 1.60 x 1.60 mm ±30m
■ Die height (including bumps): 600m
■ Bump diameter: 315m ±50m
■ Bump diameter before reflow: 300m ±10m
■ Bump height: 250m ±40m
■ Die height: 350m ±20m
■ Pitch: 500m ±50m
■ Coplanarity: 50m max
■ * Back coating height: 100m ±10m
* Optional
1.60 mm
0.5mm
0.25mm
1.60 mm
0.5mm
0.25mm
600m
100m
600m
100m
A
C
B
1
2
3
1.6mm
A
C
B
1
2
3
1.6mm
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