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參數(shù)資料
| 型號： | TSDC05IJT |
| 廠商： | STMICROELECTRONICS |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 1.2 W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA9 |
| 封裝： | LEAD FREE, FCP-9 |
| 文件頁數(shù)： | 23/32頁 |
| 文件大小： | 714K |
| 代理商： | TSDC05IJT |
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TS4990
Absolute maximum ratings and operating conditions
3/32
1
Absolute maximum ratings and operating conditions
Table 1.
Absolute maximum ratings (AMR)
Symbol
Parameter
Value
Unit
VCC
Supply voltage (1)
6V
Vin
Input voltage (2)
GND to VCC
V
Toper
Operating free-air temperature range
-40 to + 85
°C
Tstg
Storage temperature
-65 to +150
°C
Tj
Maximum junction temperature
150
°C
Rthja
Thermal resistance junction to ambient
Flip chip (3)
MiniSO-8
DFN8
250
215
120
°C/W
Pdiss
Power dissipation
Internally limited
ESD
HBM: Human body model(4)
MM: Machine model(5)
2
200
kV
V
Latch-up immunity
200
mA
Lead temperature (soldering, 10sec)
Lead temperature (soldering, 10sec) for lead-free version
250
260
°C
1.
All voltage values are measured with respect to the ground pin.
2.
The magnitude of the input signal must never exceed VCC + 0.3 V / GND - 0.3 V.
3.
The device is protected in case of over temperature by a thermal shutdown active at 150° C.
4.
Human body model: A 100 pF capacitor is charged to the specified voltage, then discharged through a 1.5 k
Ω resistor
between two pins of the device. This is done for all couples of connected pin combinations while the other pins are floating.
5.
Machine model: A 200 pF capacitor is charged to the specified voltage, then discharged directly between two pins of the
device with no external series resistor (internal resistor < 5
Ω). This is done for all couples of connected pin combinations
while the other pins are floating.
Table 2.
Operating conditions
Symbol
Parameter
Value
Unit
VCC
Supply voltage
2.2 to 5.5
V
Vicm
Common mode input voltage range
1.2V to VCC
V
VSTBY
Standby voltage input:
Device ON
Device OFF
1.35
≤ VSTBY ≤ VCC
GND
≤ VSTBY ≤ 0.4
V
RL
Load resistor
≥ 4
Ω
TSD
Thermal shutdown temperature
150
°C
Rthja
Thermal resistance junction to ambient
Flip-chip (1)
MiniSO-8
DFN8(2)
100
190
40
°C/W
1.
This thermal resistance is reached with a 100 mm2 copper heatsink surface.
2.
When mounted on a 4-layer PCB.
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