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參數(shù)資料
型號(hào)： UBA2050
廠商： NXP Semiconductors N.V.
英文描述： One-chip telephone ICs with speech, dialler and ringer functions(帶語(yǔ)音，撥號(hào)及振鈴功能的單片電話芯片)
中文描述： 一個(gè)有語(yǔ)言，撥號(hào)及鈴聲功能（帶語(yǔ)音，撥號(hào)及振鈴功能的單片電話芯片集成電路芯片的電話）
文件頁(yè)數(shù)： 49/52頁(yè)
文件大小： 278K
代理商： UBA2050
2000 May 19
49
Philips Semiconductors
Product specification
One-chip telephone ICs with speech,
dialler and ringer functions
UBA2050(A); UBA2051(A;C)
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
相關(guān)PDF資料
PDF描述
UBA2050A One-chip telephone ICs with speech, dialler and ringer functions(帶語(yǔ)音，撥號(hào)及振鈴功能的單片電話芯片)
UBA2051 One-chip telephone ICs with speech, dialler and ringer functions
UBA2051A One-chip telephone ICs with speech, dialler and ringer functions
UBA2051AT One-chip telephone ICs with speech, dialler and ringer functions
UBA2051C One-chip telephone ICs with speech, dialler and ringer functions
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
UBA2050A 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:One-chip telephone ICs with speech, dialler and ringer functions
UBA2050AT 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:One-chip telephone ICs with speech, dialler and ringer functions
UBA2050T 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:One-chip telephone ICs with speech, dialler and ringer functions
UBA2051 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:One-chip telephone ICs with speech, dialler and ringer functions
UBA2051A 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:One-chip telephone ICs with speech, dialler and ringer functions
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