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參數資料
| 型號： | UDA1340 |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | Codec |
| 英文描述： | Low-voltage low-power stereo audio CODEC with DSP features |
| 中文描述： | 低電壓低功耗立體聲音頻編解碼器與數字信號處理功能 |
| 文件頁數： | 21/24頁 |
| 文件大小： | 154K |
| 代理商： | UDA1340 |
1997 Jul 09
21
Philips Semiconductors
Preliminary specification
Low-voltage low-power stereo audio
CODEC with DSP features
UDA1340
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook”(order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all SSOP
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250
°
C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45
°
C.
Wave soldering
Wave soldering is
not
recommended for SSOP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
If wave soldering cannot be avoided, the following
conditions must be observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
The longitudinal axis of the package footprint must
be parallel to the solder flow and must incorporate
solder thieves at the downstream end.
Even with these conditions, only consider wave
soldering SSOP packages that have a body width of
4.4 mm, that is SSOP16 (SOT369-1) or
SSOP20 (SOT266-1)
.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
°
C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
°
C within
6 seconds. Typical dwell time is 4 seconds at 250
°
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
°
C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
°
C.
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相關代理商/技術參數 |
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| UDA1340M | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Low-voltage low-power stereo audio CODEC with DSP features |
| UDA1341TS | 制造商:NXP Semiconductors 功能描述: 制造商:NXP Semiconductors 功能描述:SOUNDCARD CIRCUITS, 28 Pin, Plastic, SSOP |
| UDA1341TS/N1 | 制造商:NXP Semiconductors 功能描述:IC CODEC AUDIO MINIDISC 28-SSOP 制造商:NXP Semiconductors 功能描述:IC, CODEC, AUDIO, MINIDISC, 28-SSOP 制造商:NXP Semiconductors 功能描述:Economy audio CODEC,UDA1341TS/N1 SSOP28 |
| UDA1341TS/N1,512 | 功能描述:接口—CODEC AUDIO CODEC MINIDISC RoHS:否 制造商:Texas Instruments 類型: 分辨率: 轉換速率:48 kSPs 接口類型:I2C ADC 數量:2 DAC 數量:4 工作電源電壓:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:DSBGA-81 封裝:Reel |
| UDA1341TS/N1,518 | 功能描述:接口—CODEC MINIDISC AUDIO CODEC RoHS:否 制造商:Texas Instruments 類型: 分辨率: 轉換速率:48 kSPs 接口類型:I2C ADC 數量:2 DAC 數量:4 工作電源電壓:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:DSBGA-81 封裝:Reel |
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