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參數資料
| 型號： | W27C020P-90 |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | PROM |
| 英文描述： | 256K X 8 ELECTRICALLY ERASABLE EPROM |
| 中文描述： | 256K X 8 EEPROM 12V, 90 ns, PQCC32 |
| 封裝： | PLASTIC, LCC-32 |
| 文件頁數： | 13/14頁 |
| 文件大小： | 160K |
| 代理商： | W27C020P-90 |
Preliminary W27C020
Publication Release Date: September 1998
- 13 -
Revision A1
PACKAGE DIMENSIONS
32-pin P-DIP
1. Dimensions D Max. & S include mold flash or tie bar burrs.
4. Dimension B1 does not include dambar protrusion/intrusion.
5. Controlling dimension: Inches.
1.37
1.22
0.054
0.048
Notes:
Symbol
Min. Nom. Max.
Max.
Nom.
Min.
Dimension in Inches
Dimension in mm
A
A
A
B
B
1
c
D
E
E
1
e
L
a
A
S
1
2
0.050
1.27
0.210
5.33
0.010
0.150
0.016
0.155
0.018
0.160
0.022
3.81
0.41
0.25
3.94
0.46
4.06
0.56
0.008
0.120
0.670
0.010
0.130
0.014
0.140
0.20
3.05
0.25
3.30
0.36
3.56
0.555
0.550
0.545
14.10
13.97
13.84
17.02
15.24
14.99
15.49
0.600
0.590
0.610
2.29
2.54
2.79
0.090
0.100
0.110
1
e
1.650
1.660
41.91
42.16
0
15
0.085
2.16
0.650
0.630
16.00
16.51
15
0
Seating Plane
e
A
2
A
a
c
E
Base Plane
1
A
1
e
L
A
S
1
E
D
1
B
B
32
1
16
17
32-Lead PLCC
L
c
1
b
2
A
H
E
E
e
b
D H
D
y
A
A
1
Seating Plane
E
G
G
D
1
13
14
20
29
32
4
5
21
30
1. Dimensions D & E do not include interlead flash.
2. Dimension b1 does not include dambar protrusion/intrusion.
3. Controlling dimension: Inches.
4. General appearance spec. should be based on final
Symbol
Min.
Nom.
Max.
Max.
Nom.
Min.
Dimension in Inches
Dimension in mm
3.56
0.50
2.80
2.67
2.93
0.71
0.66
0.81
0.41
0.46
0.56
0.20
0.25
0.35
13.89
13.97
14.05
11.35
11.43
11.51
1.27
12.45
12.95
13.46
9.91
10.41
10.92
14.86
14.99
15.11
12.32
12.45
12.57
1.91
2.29
0.004
0.095
0.090
0.075
0.495
0.490
0.485
0.595
0.590
0.585
0.430
0.410
0.390
0.530
0.510
0.490
0.050
0.453
0.450
0.447
0.553
0.550
0.547
0.014
0.010
0.008
0.022
0.018
0.016
0.032
0.026
0.028
0.115
0.105
0.110
0.020
0.140
1.12
1.42
0.044
0.056
0
°
10
°
10
°
0
°
0.10
2.41
Notes:
A
A
A
b
1
b
c
D
E
e
G
D
G
E
H
E
L
y
θ
1
2
H
D
θ
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