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參數資料
| 型號： | W3E32M64S-200SBM |
| 英文描述： | 32Mx64 DDR SDRAM |
| 中文描述： | 32Mx64 DDR內存 |
| 文件頁數： | 1/17頁 |
| 文件大小： | 735K |
| 代理商： | W3E32M64S-200SBM |
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White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
W3E32M64S -X S BX
July 2006
Rev. 5
32Mx64 DDR SDRAM
FEATURES
DDR SDRAM rate = 200, 250, 266, 333**
Package:
208 Plastic Ball Grid Array (PBGA),
13 x 22mm
2.5V ±0.2V core power supply
2.5V I/O (SSTL_2 compatible)
Differential clock in puts (CK and CK#)
Commands entered on each positive CK
edge
Internal pipelined double-data-rate (DDR)
ar chi ec ure; two data accesses per clock cy cle
Programmable Burst length: 2,4 or 8
Bidirectional data strobe (DQS) transmitted/
re ceived with data, i.e., source-syn chro nous data
capture (one per byte)
DQS edge-aligned with data for READs; center-
aligned with data for WRITEs
DLL to align DQ and DQS transitions with CLK
Four internal banks for concurrent operation
Data mask (DM) pins for masking write data
(one per byte)
Programmable IOL/IOH option
Auto precharge option
Auto Refresh and Self Refresh Modes
Commercial, Industrial and Military
TemperatureRanges
Organized as 32M x 64
Can be user organized as 2x32Mx32 or
4x32Mx16
Weight: W3E32M64S-XSBX — 1.5 grams typical
* This product is subject to change without notice.
**
For 333Mbs operation of Industrial temperature CL = 2.5, at Military temperature
CL = 3.
BENEFITS
73% Space Savings vs. FPBGA
43% Space Savings vs TSOP
Re duced part count
21% I/O reduction vs TSOP
13% I/O reduction vs FPBGA
Re duced trace lengths for low er par a sit c
ca pac ance
Suit able for hi-re i abil y ap pli ca ions
Lam nate in er pos er for op i mum TCE match
Upgradeable to 64M x 64 den si y (con act fac o y
for information)
GENERAL DESCRIPTION
The 256MByte (2Gb) DDR SDRAM is a high-speed CMOS,
dy nam c ran dom-access, memory using 4 chips containing
536,870,912 bits. Each chip is internally configured as a
quad-bank DRAM.
The 256MB DDR SDRAM uses a double data rate
ar chi ec ure to achieve high-speed operation. The
double data rate ar chi ec ure is essentially a 2n-prefetch
architecture with an in er ace designed to transfer two data
words per clock cycle at the I/O pins. A single read or write
access for the 256MB DDR SDRAM effectively consists of
a single 2n-bit wide, one-clock-cycle data transfer at the
internal DRAM core and two cor e spond ng n-bit wide,
one-half-clock-cycle data transfers at the I/O pins.
A bi-directional data strobe (DQS) is transmitted externally,
along with data, for use in data capture at the receiver.
strobe transmitted by the DDR SDRAM during READs and
by the memory controller during WRITEs. DQS is edge-
aligned with data for READs and center-aligned with data
for WRITEs. Each chip has two data strobes, one for the
lower byte and one for the upper byte.
The 256MB DDR SDRAM operates from a differential clock
(CK and CK#); the crossing of CK going HIGH and CK
going LOW will be referred to as the positive edge of CK.
Com mands (ad dress and control signals) are registered
at every positive edge of CK. Input data is registered on
both edg es of DQS, and out put data is ref er enced to both
edges of DQS, as well as to both edges of CK.
相關PDF資料 |
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| W3E32M64S-250SBC | 32Mx64 DDR SDRAM |
| W3E32M64S-250SBI | 32Mx64 DDR SDRAM |
| W3E32M64S-250SBM | 32Mx64 DDR SDRAM |
| W3E32M64S-266SBC | 32Mx64 DDR SDRAM |
| W3E32M64S-XSBX | DDR SDRAM STACKED MCP |
相關代理商/技術參數 |
參數描述 |
|---|---|
| W3E32M64S-250BC | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 250 MHZ, 219 PBGA, COMMERCIAL TEMP. - Bulk |
| W3E32M64S-250BI | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 250 MHZ, 219 PBGA, INDUSTRIAL TEMP. - Bulk |
| W3E32M64S-250BM | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 250 MHZ, 219 PBGA, MIL-TEMP. - Bulk |
| W3E32M64S-250SBC | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 250 MHZ, 208 PBGA, COMMERCIAL TEMP. - Bulk |
| W3E32M64S-250SBI | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 250 MHZ, 208 PBGA, INDUSTRIAL TEMP. - Bulk |
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