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參數(shù)資料
型號(hào)： W9725G6IB-18
廠商： WINBOND ELECTRONICS CORP
元件分類(lèi)： DRAM
英文描述： 16M X 16 DDR DRAM, 0.35 ns, PBGA84
封裝： 8 X 12.50 MM, ROHS COMPLIANT, WBGA-84
文件頁(yè)數(shù)： 1/69頁(yè)
文件大小： 1644K
代理商： W9725G6IB-18
PRELIMINARY W9725G6IB
4M ×
×
× 4 BANKS ×
×
× 16 BIT DDR2 SDRAM
Publication Release Date:Nov. 14, 2008
- 1 -
Revision P04
Table of Contents-
1.
GENERAL DESCRIPTION ...................................................................................................................4
2.
FEATURES ...........................................................................................................................................4
3.
KEY PARAMETERS .............................................................................................................................5
4.
BALL CONFIGURATION ......................................................................................................................6
5.
BALL DESCRIPTION............................................................................................................................7
6.
BLOCK DIAGRAM ................................................................................................................................8
7.
FUNCTIONAL DESCRIPTION..............................................................................................................9
7.1.
Power-up and Initialization Sequence ...................................................................................................9
7.2.
Mode Register and Extended Mode Registers Operation ...................................................................10
7.2.1.
Mode Register Set Command (MRS)...............................................................................10
7.2.2.
Extend Mode Register Set Commands (EMRS) ..............................................................11
7.2.2.1.
Extend Mode Register Set Command (1), EMR (1)................................................11
7.2.2.2.
DLL Enable/Disable................................................................................................12
7.2.2.3.
Extend Mode Register Set Command (2), EMR (2)................................................13
7.2.2.4.
Extend Mode Register Set Command (3), EMR (3)................................................14
7.2.3.
Off-Chip Driver (OCD) Impedance Adjustment ................................................................15
7.2.3.1.
Extended Mode Register for OCD Impedance Adjustment ....................................16
7.2.3.2.
OCD Impedance Adjust..........................................................................................16
7.2.3.3.
Drive Mode .............................................................................................................17
7.2.4.
On-Die Termination (ODT)...............................................................................................18
7.2.5.
ODT related timings .........................................................................................................18
7.2.5.1.
MRS command to ODT update delay.....................................................................18
7.3.
Command Function.............................................................................................................................20
7.3.1.
Bank Activate Command..................................................................................................20
7.3.2.
Read Command ...............................................................................................................20
7.3.3.
Write Command ...............................................................................................................20
7.3.4.
Burst Read with Auto-precharge Command.....................................................................21
7.3.5.
Burst Write with Auto-precharge Command.....................................................................21
7.3.6.
Precharge All Command ..................................................................................................21
7.3.7.
Self Refresh Entry Command ..........................................................................................21
7.3.8.
Self Refresh Exit Command.............................................................................................21
7.3.9.
Refresh Command ...........................................................................................................22
7.3.10.
No-Operation Command ..................................................................................................23
7.3.11.
Device Deselect Command..............................................................................................23
7.4.
Read and Write access modes ...........................................................................................................23
7.4.1.
Posted CAS ....................................................................................................................23
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相關(guān)代理商/技術(shù)參數(shù)
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W9725G6IB-25 功能描述:IC DDR2-800 SDRAM 256MB 84-WBGA RoHS:是 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類(lèi)型:EEPROM 存儲(chǔ)容量:4K (512 x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:8-MFP 包裝:帶卷 (TR)
W9725G6JB 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:4M ? 4 BANKS ? 16 BIT DDR2 SDRAM
W9725G6JB-25 制造商:Winbond Electronics Corp 功能描述:DRAM Chip DDR2 SDRAM 256M-Bit 16Mx16 1.8V 84-Pin WBGA 制造商:Winbond Electronics 功能描述:512MB DDRII
W9725G6JB25I 功能描述:IC DDR2 SDRAM 256MBIT 84WBGA RoHS:是 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:150 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類(lèi)型:EEPROM 存儲(chǔ)容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:2.5 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-VFDFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:8-DFN（2x3） 包裝:管件 產(chǎn)品目錄頁(yè)面:1445 (CN2011-ZH PDF)
W9725G6KB-18 制造商:Winbond Electronics 功能描述:IC MEMORY 制造商:Winbond Electronics Corp 功能描述:IC MEMORY
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