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參數資料
| 型號： | WED3C7558M-300BX |
| 英文描述： | RISC Microprocessor Multichip Package(精簡指令集計算機微處理器（多芯片封裝）) |
| 中文描述： | RISC微處理器的多芯片封裝（精簡指令集計算機微處理器（多芯片封裝）） |
| 文件頁數： | 1/12頁 |
| 文件大?。?/td> | 353K |
| 代理商： | WED3C7558M-300BX |
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
HI-RELIABILITY PRODUCT
WED3C7558M-300BX
RISC Microprocessor Multichip Package
ADVANCED*
January 2001 Rev. 2
FIG. 1
Multi-Chip Package Diagram
OVERVIEW
The WEDC 755/SSRAM multichip package is targeted for high
performance, space sensitive, low power systems and supports the
following power management features: doze, nap, sleep and dynamic
power management.
The WED3C7558M-300BX multichip package consists of:
755 RISC processor
Dedicated 1MB SSRAM L2 cache, configured as 128Kx72
21mmx25mm, 255 Ceramic Ball Grid Array (CBGA)
Maximum Core frequency = 300MHz
Maximum L2 Cache frequency = 150MHz
Maximum 60x Bus frequency = 66MHz
The WED3C7558M-300BX is offered in Commercial (0
°
C to +70
°
C),
industrial (-40
°
C to +85
°
C) and military (-55
°
C to +125
°
C) temperature
ranges and is well suited for embedded applications such as missiles,
aerospace, flight computers, fire control systems and rugged critical
systems.
* This data sheet describes a product that may or may not be under
development, non-qualified, and is subject to change or cancellation without
notice.
FEATURES
I
Footprint compatible with WED3C750A8M-200BX
I
Footprint compatible with Motorola MPC745
SSRAM
SSRAM
μ
P
755
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| WED3C7558M350BC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:RISC Microprocessor Multichip Package |
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| WED3C7558M-350BI | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
| WED3C7558M350BM | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:RISC Microprocessor Multichip Package |
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