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參數(shù)資料

White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com

April 2002 Rev. 6

Footprint compatible with WED3C750A8M-200BX

Footprint compatible with Motorola MPC 745

The WEDC 755/SSRAM multichip package is targeted for

high performance, space sensitive, low power systems and

supports the following power management features: doze,

nap, sleep and dynamic power management.

The WED3C7558M-XBX multichip package consists of:

755 RISC processor

Dedicated 1MB SSRAM L2 cache, configured as

128Kx72

21mmx25mm, 255 Ceramic Ball Grid Array (CBGA)

Core Frequency/L2 Cache Frequency (300MHz/

150MHz, 350MHz/175MHz)

Maximum 60x Bus frequency = 66MHz

The WED3C7558M-XBX is offered in Commercial (0°C to

+70°C), industrial (-40°C to +85°C) and military (-55°C to

+125°C) temperature ranges and is well suited for embed-

ded applications such as missiles, aerospace, flight com-

puters, fire control systems and rugged critical systems.

*This data sheet describes a product that s subject to change without notice.

相關(guān)代理商/技術(shù)參數(shù)	參數(shù)描述
WED3C755E8M300BC	制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:RISC MICROPROCESSOR MULTI-CHIP PACKAGE
WED3C755E8M-300BC	制造商:未知廠家制造商全稱:未知廠家功能描述:Microprocessor
WED3C755E8M300BI	制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:RISC MICROPROCESSOR MULTI-CHIP PACKAGE
WED3C755E8M-300BI	制造商:未知廠家制造商全稱:未知廠家功能描述:Microprocessor
WED3C755E8M300BM	制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:RISC MICROPROCESSOR MULTI-CHIP PACKAGE

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