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參數資料
型號: XC3SD3400A-4FGG676C
廠商: Xilinx Inc
文件頁數: 1/7頁
文件大小: 0K
描述: SPARTAN-3ADSP FPGA 3400K 676FBGA
產品培訓模塊: Extended Spartan 3A FPGA Family
標準包裝: 40
系列: Spartan®-3A DSP
LAB/CLB數: 5968
邏輯元件/單元數: 53712
RAM 位總計: 2322432
輸入/輸出數: 469
門數: 3400000
電源電壓: 1.14 V ~ 1.26 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 676-BGA
供應商設備封裝: 676-FBGA(27x27)
配用: 122-1532-ND - KIT DEVELOPMENT SPARTAN 3ADSP
其它名稱: 122-1539
DS706 (v1.1) February 2, 2011
Product Specification
1
Copyright 2008–2011 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. PCI, PCI Express, PCIe, and PCI-X are trademarks of PCI-SIG. All other trademarks are the property of their respective owners.
General Description
The Extended Spartan-3A family of Field-Programmable Gate Arrays (FPGAs) solves the design challenges in many high-
volume, cost-sensitive electronic applications. With 12 devices ranging from 50,000 to 3.4 million system gates (as shown in
Table 1), the Extended Spartan-3A family provides a broad range of densities and package options, integrated DSP MACs,
and low total system cost while increasing functionality. The Extended Spartan-3A family includes the Spartan-3A devices
and the higher density Spartan-3A DSP devices. It also includes the nonvolatile Spartan-3AN devices, which combine
leading-edge FPGA and flash technologies to provide a new evolution in security, protection and functionality, ideal for
space-critical or secure applications.
The Extended Spartan-3A family improves system performance and reduces the cost of configuration. These
enhancements, combined with proven 90 nm process technology, deliver more functionality and bandwidth per dollar.
Because of its exceptionally low cost, the Extended Spartan-3A family is ideally suited to a wide range of consumer
electronics applications, including broadband access, home networking, display/projection, and digital television equipment.
The Extended Spartan-3A family is a superior alternative to mask-programmed ASICs. FPGAs avoid the high initial cost,
lengthy development cycles, the inherent inflexibility of conventional ASICs, and permit field design upgrades.
Summary of Extended Spartan-3A Family Features
Very low-cost, high-performance logic solution for high-
volume, cost-conscious applications
Low-cost QFP and BGA packaging, Pb-free options
Flexible power management
Leading connectivity platform
Abundant, flexible logic resources
Dedicated resources for high-speed digital signal
processing applications
Precise clock management with up to eight Digital
Clock Managers (DCMs)
Integrated flash memory in Spartan-3AN devices
Eight low-skew global clock networks, eight additional
clocks per half device, plus abundant low-skew routing
Hierarchical SelectRAM memory architecture
Configuration interface to industry-standard PROMs
Complete Xilinx ISE and free WebPACK
development system software support
MicroBlaze and PicoBlaze embedded processors
reduce risk
Low-cost starter kits from Xilinx, distributors, and third
parties
XA versions available for Automotive applications
7
Extended Spartan-3A Family Overview
DS706 (v1.1) February 2, 2011
Product Specification
R
Table 1: Summary of Extended Spartan-3A Family Attributes
Device
System
Gates
Equivalent
Logic Cells
CLBs
Slices
Distributed
RAM Bits(1)
Block RAM
Bits(1)
In-System
Flash Bits(2)
Dedicated
Multipliers
DSP48As
DCMs
Maximum
User I/O
XC3S50A/AN
50K
1,584
176
704
11K
54K
1M
3
-
2
144
XC3S200A/AN
200K
4,032
448
1,792
28K
288K
4M
16
-
4
248(3)
XC3S400A/AN
400K
8,064
896
3,584
56K
360K
4M
20
-
4
311
XC3S700A/AN
700K
13,248
1,472
5,888
92K
360K
8M
20
-
8
372
XC3S1400A/AN
1400K
25,344
2,816
11,264
176K
576K
16M
32
-
8
502
XC3SD1800A
1800K
37,440
4,160
16,640
260K
1,512K
-
84
8
519
XC3SD3400A
3400K
53,712
5,968
23,872
373K
2,268K
-
126
8
469
Notes:
1.
By convention, one Kb is equivalent to 1,024 bits.
2.
In-System flash is available in the Spartan-3AN devices only.
3.
Maximum user I/O for XC3S200AN is 195.
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XC3SD3400A-4FGG676I 功能描述:SPARTAN-3ADSP FPGA 3400K 676FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:Spartan®-3A DSP 產品變化通告:Step Intro and Pkg Change 11/March/2008 標準包裝:1 系列:Virtex®-5 SXT LAB/CLB數:4080 邏輯元件/單元數:52224 RAM 位總計:4866048 輸入/輸出數:480 門數:- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA,FCBGA 供應商設備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC3SD3400A-5CS484C 功能描述:SPARTAN-3ADSP FPGA 3400K 484CSA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:Spartan®-3A DSP 產品變化通告:Step Intro and Pkg Change 11/March/2008 標準包裝:1 系列:Virtex®-5 SXT LAB/CLB數:4080 邏輯元件/單元數:52224 RAM 位總計:4866048 輸入/輸出數:480 門數:- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA,FCBGA 供應商設備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC3SD3400A-5CSG484C 功能描述:SPARTAN-3ADSP FPGA 3400K 484CSA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:Spartan®-3A DSP 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數:3411 邏輯元件/單元數:43661 RAM 位總計:2138112 輸入/輸出數:358 門數:- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應商設備封裝:676-FBGA(27x27)
XC3SD3400A-5FG676C 功能描述:SPARTAN-3ADSP FPGA 3400K 676FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:Spartan®-3A DSP 產品變化通告:Step Intro and Pkg Change 11/March/2008 標準包裝:1 系列:Virtex®-5 SXT LAB/CLB數:4080 邏輯元件/單元數:52224 RAM 位總計:4866048 輸入/輸出數:480 門數:- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA,FCBGA 供應商設備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC3SD3400A-5FGG676C 功能描述:SPARTAN-3ADSP FPGA 3400K 676FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:Spartan®-3A DSP 產品變化通告:Step Intro and Pkg Change 11/March/2008 標準包裝:1 系列:Virtex®-5 SXT LAB/CLB數:4080 邏輯元件/單元數:52224 RAM 位總計:4866048 輸入/輸出數:480 門數:- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA,FCBGA 供應商設備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
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