參數資料
| 型號： | 164000F00000G |
| 廠商： | Aavid Thermalloy |
| 文件頁數： | 106/116頁 |
| 文件大小： | 0K |
| 描述： | THERMAL EPOXY |
| MSDS 材料安全數據表： | 1600 Hardener 1600 Resin |
| 標準包裝： | 1 |
| 系列： | Ther-O-Bond 1600 |
| 類型： | 樹脂和硬化劑 |
| 尺寸/尺寸： | 40 克容器 |
| 其它名稱： | 000113 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁第100頁第101頁第102頁第103頁第104頁第105頁當前第106頁第107頁第108頁第109頁第110頁第111頁第112頁第113頁第114頁第115頁第116頁
9
HO
W
T
O
S
ELECT
A
HEA
T
SINK
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
The basic equation for heat transfer or power dissipation may be stated as follows:
Where:
PD = the power dissipated by the semiconductor device in watts.
ΔT = the temperature difference of driving potential which causes the flow of heat.
ΣRθ = the sum of the thermal resistances of the heat flow path across which ΔT exists.
The above relationship may be stated in the following forms:
The above equations are generally used to determine the required thermal resistance of the heat sink (RθSA),
since the heat dissipation, maximum junction and/or case temperature, and ambient temperature are known or set.
How To Select a Heat Sink
Where:
TJ = the junction temperature in °C (maximum is usually stated by the manufacturer of the semiconductor device).
TC = case temperature of the semiconductor device in °C.
TS = temperature of the heat sink mounting surface in thermal contact with the semiconductor device in °C.
TA = ambient air temperature in °C.
RθJC = thermal resistance from junction to case of the semiconductor device in °C per watt
(usually stated by manufacturer of semiconductor device).
RθCS = thermal resistance through the interface between the semiconductor device
and the surface on which it is mounted in °C per watt.
RθSA = thermal resistance from mounting surface to ambient or thermal resistance of heat sink in °C per watt.
Figure 1 indicates the location of the various heat
flow paths, temperatures and thermal resistances.
The common practice is to represent the system with
a network of resistances in series as shown in Figure 2.
Atmosphere
or ambient
Mounting surface
(cooler/dissipator)
Semiconductor case
Junction
(heat source)
Interface
Heat flow path mounting
surface to ambient, equation (3)
Heat flow path case
to ambient equation (2)
Heat flow path junction
to ambient, equation (1)
P
D
P
D
T
A
R
θSA
R
θCS
R
θJC
T
S
T
C
T
A
T
J
TJ–TA
PD =
RθJC + RθCS + RθSA
TC–TA
PD =
RθCS + RθSA
TS–TA
PD =
RθSA
Δ T
PD =
ΣRθ
RθCS
RθJC
TS
TA
TJ
RθSA
TC
FIGURE 1
FIGURE 2
How to select a heat sink
相關PDF資料 |
PDF描述 |
|---|---|
| 1554T2GY | BOX POLY 7.1X4.7X3.5" GREY |
| 1599RHBK | BOX ABS 8.66X4.33X1.76" BLACK |
| 1590KBK | BOX ALUM 4.92X4.92X3.11" BLACK |
| SMBJ22CA-E3/52 | TVS BIDIRECT 600W 22V 5% SMB |
| 4952G | THERMAL EPOXY |
相關代理商/技術參數 |
參數描述 |
|---|---|
| 164001 | 制造商:ERNI Electronics 功能描述:Conn D-Subminiature M 9 POS 2.74mm Solder ST SMD 9 Terminal 1 Port Tray |
| 16400-1 | 制造商:TE Connectivity 功能描述: |
| 164001000 | 制造商:Laird Technologies Inc 功能描述:NOSG COIL BF CTL |
| 1640010000 | 功能描述:CONN PCB 3.5MM 270F 10POS SN OR RoHS:是 類別:連接器，互連式 >> 接線座 - 接頭，插頭和插口 系列:Omnimate BL 其它有關文件:ED Part Number Breakdown 產品目錄繪圖:EDZ1200 Series Front EDZ1200 Series Side 標準包裝:50 系列:EDZ1200 端接塊類型:插頭，母插口 每電平位置:12 間距:0.200"（5.08mm） 級別數目:1 接頭定向:- 插頭導線入口:180° 端子:螺釘 線規:12-22 AWG 電流:15A 電壓:300V 安裝類型:自由懸掛 特點:固定鎖（非導線側） 顏色:綠 包裝:散裝 配套產品:EDSTLZ975/12-SW-ND - TERM BLOCK HDR 5.08MM 12POS PCBEDSTLZ970/12-SW-ND - TERM BLOCK HDR 5.08MM 12POS PCBEDSTLZ975/12-F-ND - TERM BLOCK HDR 5.08MM 12POS PCBEDSTLZ970/12-F-ND - TERM BLOCK HDR 5.08MM 12POS PCBEDSTLZ955/12-OE-ND - TERM BLOCK HDR 5.08MM 12POS PCBEDSTLZ950/12-OE-ND - TERM BLOCK HDR 5.08MM 12POS PCBED1859-ND - TERM BLOCK HDR 5.08MM 12POS PCBED1827-ND - TERM BLOCK HDR 5.08MM 12POS PCBED1917-ND - TERM BLOCK HDR 5.08MM 12POS PCB 其它名稱:ED1993 |
| 16-4001-01 | 功能描述:IC MEMORY 1GB FLASH 3.0V 56TSOP 制造商:cypress semiconductor corp 系列:* 零件狀態:Last Time Buy 標準包裝:91 |
發布緊急采購，3分鐘左右您將得到回復。