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參數(shù)資料
| 型號(hào)： | 164000F00000G |
| 廠商： | Aavid Thermalloy |
| 文件頁(yè)數(shù)： | 60/116頁(yè) |
| 文件大小： | 0K |
| 描述： | THERMAL EPOXY |
| MSDS 材料安全數(shù)據(jù)表： | 1600 Hardener 1600 Resin |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | Ther-O-Bond 1600 |
| 類型： | 樹(shù)脂和硬化劑 |
| 尺寸/尺寸： | 40 克容器 |
| 其它名稱： | 000113 |
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48
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
6232
Space saving staggered fin heat sink
for vertical mounting TO-220 devices.
Features solderable mounting tabs
with triangular base for easy attach-
ment to the PC board.
35.00
(1.378)
3.18
(0.125)
45.06
(1.774)
20.04
(0.789)
13.34
(0.525)
25.40
(1.000)
2.29
(0.090)
4.83
(0.190)
2.67
(0.105)
12.70
(0.500)
2x
13.00
(0.512)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
5
0
20
40
60
80
100
0
2
4
6
8
10
4
3
1
2
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
ORDERING INFORMATION
6.34
(0.250)
22.22
(0.875)
17.78
(0.700)
1.57
(0.062)
8.89
(0.350)
31.75
(1.250)
19.56
(0.770)
3.96
(0.156)
10.67
(0.420)
3.18
(0.125)
THRU
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
10
0
20
40
60
80
100
0
1
2
3
4
5
8
6
2
4
0
400
200
600
800
1000
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
Copper, space saving staggered fin
heat sink for vertical mounting TO-220
devices. Features integrated solderable
mounting tabs for easy attachment to
the PC board.
6025
Copper, space saving staggered fin heat sink
5932
Space saving twisted fin heat sink
for vertical mounting TO-220 devices.
Features solderable mounting tabs for
easy attachment to the PC board.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
10
0
20
40
60
80
100
0
2
4
6
8
10
8
6
2
4
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
12.20
(0.480)
35.05
(1.380)
3.17
(0.125)
THRU
TYP 2
50.80
(2.000)
4.75
(0.187)
25.40
(1.000)
2.46
(0.097)
25.40
(1.000)
18.30
(0.720)
0.81
(0.032)
16.51
(0.650)
CL
Part Number
Description
593202B03500G
Space saving twisted fin heat sink with solderable tabs
2.84 (0.112)
ORDERING INFORMATION
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
Material: 1.27 (0.050) Thick Copper
Finish: Tin Plated
Material: 1.27 (0.050) Thick Aluminum
Finish: Black Anodize
Dia of PCB
Plated Thru
Hole for Tabs
TO-220 Heat Sinks
Position
Code
Description
Details
A
34
Solderable tab for 0.094 plated thru hole
Page 92
Part Number
Finish
6232B-MTG
Black anodize
3.10 (0.122)
6232PB-MTG
Pre-black anodize*
3.10 (0.122)
Dia of PCB
Plated Thru
Hole for Tabs
Part Number
Description
6025DG
Copper, space saving staggered fin heat sink with solderable tabs
2.54 (0.100)
Dia of PCB
Plated Thru
Hole for Tabs
*Edges cut during the manufacturing process will be unfinished.
See page 110 for more information
POPULAR OPTIONS:
Base part no.
A
593202B0 00 00G
For additional options see page 82
For additional options see page 85
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
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