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參數(shù)資料
型號: 505403B00000G
廠商: Aavid Thermalloy
文件頁數(shù): 20/116頁
文件大小: 0K
描述: BOARD LEVEL HEAT SINK
產(chǎn)品培訓(xùn)模塊: How to Select a Heat Sink
標(biāo)準(zhǔn)包裝: 500
類型: 插件板級
冷卻式包裝: TO-3
固定方法: 把緊螺栓
形狀: 方形
長度: 1.780"(45.21mm)
寬: 1.780"(45.21mm)
機(jī)座外的高度(散熱片高度): 1.250"(31.75mm)
溫升時的功耗: 7W @ 40°C
在強(qiáng)制氣流下的熱敏電阻: 在 600 LFM 時為1.5°C/W
自然環(huán)境下的熱電阻: 6°C/W
材質(zhì):
材料表面處理: 黑色陽極化處理
其它名稱: 001282
116
THE
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INTEGR
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SOL
UTION
F
OR
C
OOLING
ELECTRONICS
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886 (2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Aavid Thermalloy has the expertise to design and
manufacture cooling solutions spanning the entire
range of thermal efficiency and mechanical complexity.
The board level products displayed in this catalog
represent only a fraction of our capabilities. Most
applications require custom solutions, which is why
so many leading electronics companies partner with
Aavid Thermalloy.
For demanding applications Aavid Thermalloy
can design and validate custom innovative solutions
utilizing the most advanced engineering resources
saving you precious development time. Our manufac-
turing facilities, located in strategic markets around
the globe, deliver cost effective products providing
you a competitive advantage. From concept to
production, Aavid Thermalloy can enable your
design anywhere in the world.
The Total Integrated Solution for Cooling Electronics
There are 4 cooling mechanisms that Aavid Thermalloy and Applied Thermal Technologies take pride in
having expertise in: natural convection, forced convection, fluid phase change and liquid cooling. The
above graph is a starting point to determine which technology can be used for your system configuration.
For more information regarding any of these cooling mechanisms, please contact Aavid Thermalloy at:
www.aavidthermalloy.com
Experts at solving cooling challenges ranging from
networking, telecom and consumer electronics, to
power and biomedical devices. Our clients include
Cisco, Nortel, HP, Apple, Sun, Bio-Rad, Mitsubishi and
other industry leading companies worldwide. Utilizing
the latest CFD/FEA and experimental techniques we can:
Perform conjugate analyses with conduction,
convection and radiation
Optimize venting and fan placement
Increase power density
Reduce noise, cost and size.
Increase MTBF
Dedicated thermal engineers characterize your system
and provide the most advanced and effective cooling
solutions, saving thousands in engineering resources,
thermal modeling software, and test hardware.
相關(guān)PDF資料
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3659/64 300SF CABLE 64 COND RND RIBBON SHIELD
AXN314038J CONN SOCKET .8MM 14POS SMD
AXK6S20437YG CONN HEADER BRD/BRD .5MM 20POS
093C,AL BOX 9.50X6.34X1.90 ALMOND
1590PFL BOX ALUM 6.02X3.27X1.99" UNPTD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
505403B00100G 功能描述:散熱片 TO-3 SQ BSKT B/A 45.21 X 31.75 RoHS:否 制造商:Ampro By ADLINK 產(chǎn)品:Heat Sink Accessories 安裝風(fēng)格:Through Hole 散熱片材料: 散熱片樣式: 熱阻: 長度: 寬度: 高度: 設(shè)計目的:Express-HRR
505403B00400G 功能描述:BOARD LEVEL HEAT SINK RoHS:是 類別:風(fēng)扇,熱管理 >> 熱敏 - 散熱器 系列:- 產(chǎn)品目錄繪圖:BDN12-3CB^A01 標(biāo)準(zhǔn)包裝:300 系列:BDN 類型:頂部安裝 冷卻式包裝:分類(BGA,LGA,CPU,ASIC……) 固定方法:散熱帶,粘合劑(含) 形狀:方形,鰭片 長度:1.21"(30.73mm) 寬:1.210"(30.73mm) 直徑:- 機(jī)座外的高度(散熱片高度):0.355"(9.02mm) 溫升時的功耗:- 在強(qiáng)制氣流下的熱敏電阻:在 400 LFM 時為6.8°C/W 自然環(huán)境下的熱電阻:19.6°C/W 材質(zhì):鋁 材料表面處理:黑色陽極化處理 產(chǎn)品目錄頁面:2681 (CN2011-ZH PDF) 其它名稱:294-1099
505403B10900 制造商:Aavid Thermalloy 功能描述:BOARD LEVEL STAMPED HEAT SINKS
505403B30000 制造商:Aavid Thermalloy 功能描述:BOARD LEVEL STAMPED HEAT SINKS
5054042013 制造商:TE Connectivity 功能描述:HEAT SHRNK TBING POLYFN VIOL STK - Shrink Tubing that comes in 4ft sticks 制造商:TE Connectivity 功能描述:HEAT SHRINK TUBING 制造商:TE Connectivity 功能描述:RNF-100-3/32-VT-STK 制造商:TE Connectivity 功能描述:Heat Shrink Tubing ST Polyolefin Violet Thin Stick
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