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參數資料
| 型號： | 73S8010R-IM |
| 廠商： | TERIDIAN SEMICONDUCTOR CORP |
| 元件分類： | 模擬信號調理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, QCC32 |
| 封裝： | 5 X 5 MM, 0.80 MM HEIGHT, QFN-32 |
| 文件頁數： | 24/24頁 |
| 文件大小： | 333K |
| 代理商： | 73S8010R-IM |
73S8010R
Low Cost Smart Card Interface
DATA SHEET
Page: 9 of 24
2005 TERIDIAN Semiconductor Corporation
Rev 1.3
CARD POWER SUPPLY
The card power supply is provided by the LDO regulator, and controlled by the digital ISO-7816-3 sequencer.
Card voltage selection is carried out by bit 2 of the control register.
Choice of the VCC capacitor:
Depending on the applications, the requirements in terms of both VCC minimum voltage and transient currents that
the interface must be able to provide to the card are different. An external capacitor must be connected between
the VCC pin and to the card ground in order to guarantee stability of the LDO regulator, and to handle the
transient requirements. The type and value of this capacitor can be optimized to meet the desired specification.
The table below shows the recommended capacitors for each VPC power supply configuration and applicable
specification.
Table 1: Choice of VCC pin capacitor
OVER-TEMPERATURE MONITOR
A built-in detector monitors die temperature. Upon over-temperature condition (most likely resulting from a heavily
loaded card interface, including short circuits), a card deactivation sequence is initiated, and a fault condition is
reported to the system controller (sets bit 4 of the status register and generates an interrupt).
ON-CHIP OSCILLATOR AND CARD CLOCK
The TERIDIAN 73S8010R device has an on-chip oscillator that can generate the smart card clock using an
external crystal, connected between the pins XTALIN and XTALOUT, to set the oscillator frequency. When the
card clock signal is available from another source, it can be connected to the pin XTALIN, and the pin XTALOUT
should be left unconnected.
The card clock frequency may be chosen between 4 different division rates, defined by bits 5 and 6 of the I
2C
Control register, as per the following table:
Card power down mode (card clock STOP) is supported and is controllable through the dedicated digital inputs
bits 3 and 4 of the I
2C Control register, respectively Clock Stop, and Clock Stop Level.
Specification Requirements
System Requirements
Specification
Min VCC Voltage
allowed during
transient current
Max
transient
current
charge
Min VPC
Power
Supply
required
Capacitor
Type
Capacitor Value
EMV 4.0
4.6V
30nA.s
4.75V
3.3
F
ISO-7816-3
4.5V
20nA.s
4.75V
X5R/X7R
w/
ESR < 100m
1
F
Bit
Clksel2
Bit
Clksel1
Card Clock
0
Clkin/8
0
1
Clkin/4
1
0
Clkin/2
1
Clkin (Xtalin)
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相關代理商/技術參數 |
參數描述 |
|---|---|
| 73S8010R-IM/F | 功能描述:I2C 接口集成電路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16 |
| 73S8010R-IM/F1 | 功能描述:I2C 接口集成電路 RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16 |
| 73S8010R-IM/F2 | 功能描述:I2C 接口集成電路 RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16 |
| 73S8010R-IMR/F | 功能描述:I2C 接口集成電路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16 |
| 73S8010R-IMR/F1 | 功能描述:I2C 接口集成電路 RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16 |
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