
Philips Semiconductors
PNX15xx Series
Volume 1 of 1
Chapter 6: Boot Module
PNX15XX_SER_3
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 3 — 17 March 2006
6-10
3.2 The Specics of the Boot From Flash Memory Devices
In standalone mode PNX15xx Series fetches its TM3260 binary program and data
from a Flash memory device. The PCI module has internal DMA logic that allows,
with few MMIO register writes, to autonomously fetch data from Flash memory
devices (connected to the PCI-XIO bus) to the main memory. The typical simplied
board system is sketched in
Figure 2. The aperture settings are also presented in the
same
Figure 2. The size of the DRAM is programmable with bootstrap options
(resistor pull-up or -down) on the BOOT_MODE[6:4] pins. The Flash memory device
used for boot must be connected and therefore selectable by the XIO_SEL0 pin.
In order to be able to access the content of the Flash memory devices the following
actions are taken in the boot scripts:
1. The XIO_ACK and the XIO_D[15:8] are removed from their reset state that sets
them as GPIO pins. This is done whether the connected Flash memory device is
8- or 16-bit wide.
2. The PCI module DMA is congured depending on the BOOT_MODE[2:0] pin
value. Based on the values of these pins the PCI module knows the width and
type of the Flash memory device.
Table 7 describes the different settings used to
access the two types of Flash memory devices. The XIO Sel0 Prole MMIO
Figure 2:
System Memory Map and Block Diagram Conguration for PNX15xx Series in Standalone Mode
0xFFFF,FFFF
PNX15xx
BOOT_MODE[7:0]
XIO_SEL0
PCI Agent/Slave
DDR SDRAM
PCI-XIO Bus
8- or 16-bit NAND or
NOR FLASH/ROM
0x1BE0_0000
0x0XX0_0000
0x0000_0000
0x1C00_0000
0x2000_0000
8-256 MB DRAM
2 MB MMIO
64 MB XIO
Unused