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參數資料
型號: A42MX09-TQG176
廠商: Microsemi SoC
文件頁數: 24/142頁
文件大小: 0K
描述: IC FPGA 104I/O 176TQFP
標準包裝: 40
系列: MX
輸入/輸出數: 104
門數: 14000
電源電壓: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 176-LQFP
供應商設備封裝: 176-TQFP(24x24)
其它名稱: 1100-1051
40MX and 42MX FPGA Families
1- 8
R ev isio n 1 1
Other Architectural Features
Performance
MX devices can operate with internal clock frequencies of 250 MHz, enabling fast execution of complex
logic functions. MX devices are live on power-up and do not require auxiliary configuration devices and
thus are an optimal platform to integrate the functionality contained in multiple programmable logic
devices. In addition, designs that previously would have required a gate array to meet performance can
be integrated into an MX device with improvements in cost and time-to-market. Using timing-driven
place-and-route (TDPR) tools, designers can achieve highly deterministic device performance.
User Security
Microsemi FuseLock provides robust security against design theft. Special security fuses are hidden in
the fabric of the device and protect against unauthorized users attempting to access the programming
and/or probe interfaces. It is virtually impossible to identify or bypass these fuses without damaging the
device, making Microsemi antifuse FPGAs protected with the highest level of security available from both
invasive and noninvasive attacks.
Special security fuses in 40MX devices include the Probe Fuse and Program Fuse. The former disables
the probing circuitry while the latter prohibits further programming of all fuses, including the Probe Fuse.
In 42MX devices, there is the Security Fuse which, when programmed, both disables the probing circuitry
and prohibits further programming of the device.
Programming
Device programming is supported through the Silicon Sculptor series of programmers. Silicon Sculptor II
is a compact, robust, single-site and multi-site device programmer for the PC. With standalone software,
Silicon Sculptor II is designed to allow concurrent programming of multiple units from the same PC.
Silicon Sculptor II programs devices independently to achieve the fastest programming times possible.
After being programmed, each fuse is verified to insure that it has been programmed correctly.
Furthermore, at the end of programming, there are integrity tests that are run to ensure no extra fuses
have been programmed. Not only does it test fuses (both programmed and nonprogrammed), Silicon
Sculptor II also allows self-test to verify its own hardware extensively.
The procedure for programming an MX device using Silicon Sculptor II is as follows:
1. Load the *.AFM file
2. Select the device to be programmed
3. Begin programming
When the design is ready to go to production, Microsemi offers device volume-programming services
either through distribution partners or via In-House Programming from the factory.
For more details on programming MX devices, please refer to the Programming Antifuse Devices and the
Silicon Sculptor II user's guides.
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相關代理商/技術參數
參數描述
A42MX09-TQG176A 功能描述:IC FPGA MX SGL CHIP 14K 176-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:MX 標準包裝:40 系列:SX-A LAB/CLB數:6036 邏輯元件/單元數:- RAM 位總計:- 輸入/輸出數:360 門數:108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA(27X27)
A42MX09-TQG176I 功能描述:IC FPGA MX SGL CHIP 14K 176-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:MX 標準包裝:40 系列:SX-A LAB/CLB數:6036 邏輯元件/單元數:- RAM 位總計:- 輸入/輸出數:360 門數:108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA(27X27)
A42MX09-TQG176M 制造商:Microsemi Corporation 功能描述:FPGA 14K GATES 336 CELLS 129MHZ/215MHZ 0.45UM 3.3V/5V 176TQF - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 14K 176-TQFP 制造商:Microsemi Corporation 功能描述:IC FPGA 104 I/O 176TQFP
A42MX09-TQG176X288 制造商:Microsemi Corporation 功能描述:
A42MX09-VQ100 功能描述:IC FPGA MX SGL CHIP 14K 100-VQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:MX 標準包裝:90 系列:ProASIC3 LAB/CLB數:- 邏輯元件/單元數:- RAM 位總計:36864 輸入/輸出數:157 門數:250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA(17x17)
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