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參數(shù)資料
| 型號(hào)： | AD9236BRUZRL7-80 |
| 廠商： | ANALOG DEVICES INC |
| 元件分類(lèi)： | ADC |
| 英文描述： | 12-Bit, 80 MSPS, 3V A/D Converter |
| 中文描述： | 1-CH 12-BIT FLASH METHOD ADC, PARALLEL ACCESS, PDSO28 |
| 封裝： | LEAD FREE, MO-153AE, TSSOP-28 |
| 文件頁(yè)數(shù)： | 33/36頁(yè) |
| 文件大小： | 2056K |
| 代理商： | AD9236BRUZRL7-80 |
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AD9236
OUTLINE DIMENSIONS
28
15
14
1
8°
0°
COMPLIANT TO JEDEC STANDARDS MO-153AE
SEATING
PLANE
COPLANARITY
0.10
1.20 MAX
6.40 BSC
0.65
BSC
PIN 1
0.30
0.19
0.20
0.09
4.50
4.40
4.30
0.75
0.60
0.45
9.80
9.70
9.60
0.15
0.05
Figure 57. 28-Lead Thin Shrink Small Outline Package [TSSOP] (RU-28)—Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
0.30
0.23
0.18
0.20REF
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
12° MAX
1.00
0.85
0.80
SEATING
PLANE
COPLANARITY
0.08
1
32
8
9
25
24
16
17
BOTTOM
VIEW
0.50
0.40
0.30
3.50 REF
0.50
BSC
3.25
3.10 SQ
2.95
0.60 MAX
0.60 MAX
0.25MIN
TOP
PIN 1
INDICATOR
PIN 1
INDICATOR
5.00
BSC SQ
4.75
BSC SQ
Figure 58. 32-Lead Frame Chip Scale Package [LFCSP] (CP-32-1)—Dimensions shown in millimeters
ORDERING GUIDE
AD9236 Products
AD9236BRU-80
AD9236BRURL7-80
AD9236BRUZ-80
1
AD9236BRUZRL7-80
1
AD9236BCP-80
2
AD9236BCPRL7-80
2
AD9236BCPZ-80
1, 2
AD9236BCPZRL7-80
1, 2
AD9236BRU-80EB
AD9236BCP-80EB
2
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
Thin Shrink Small Outline (TSSOP)
Thin Shrink Small Outline (TSSOP)
Thin Shrink Small Outline (TSSOP)
Thin Shrink Small Outline (TSSOP)
Lead Frame Chip Scale (LFCSP)
Lead Frame Chip Scale (LFCSP)
Lead Frame Chip Scale (LFCSP)
Lead Frame Chip Scale (LFCSP)
TSSOP Evaluation Board
LFCSP Evaluation Board
Package Outline
RU-28
RU-28
RU-28
RU-28
CP-32-1
CP-32-1
CP-32-1
CP-32-1
1
Z = Lead Free.
2
It is recommended that the exposed paddle be soldered to the ground plane for the LFCSP package. There is an increased reliability of the solder joints, and the maxi-
mum thermal capability of the package is achieved with the exposed paddle soldered to the customer board.
Rev. A | Page 33 of 36
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AD9237 | 制造商:AD 制造商全稱(chēng):Analog Devices 功能描述:12-Bit, 20 MSPS/40 MSPS/65 MSPS 3 V Low Power A/D Converter |
| AD9237BCP-20EB | 制造商:Analog Devices 功能描述:12 BIT 3V 20 MSPS LOW POWER ADC - Trays |
| AD9237BCP-40EB | 制造商:Analog Devices 功能描述:12-BIT 3V 40 MSPS LOW POWER ADC - Trays |
| AD9237BCP-65EB | 制造商:Analog Devices 功能描述:12-BIT 3V 65 MSPS LOW POWER ADC - Boxed Product (Development Kits) |
| AD9237BCPZ-20 | 功能描述:IC ADC 12BIT SGL 20MSPS 32LFCSP RoHS:是 類(lèi)別:集成電路 (IC) >> 數(shù)據(jù)采集 - 模數(shù)轉(zhuǎn)換器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:- 位數(shù):12 采樣率（每秒）:3M 數(shù)據(jù)接口:- 轉(zhuǎn)換器數(shù)目:- 功率耗散（最大）:- 電壓電源:- 工作溫度:- 安裝類(lèi)型:表面貼裝 封裝/外殼:SOT-23-6 供應(yīng)商設(shè)備封裝:SOT-23-6 包裝:帶卷 (TR) 輸入數(shù)目和類(lèi)型:- |
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