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參數資料
| 型號： | ADSP-21262SBBCZ150 |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 數字信號處理 |
| 英文描述： | Embedded Processor |
| 中文描述： | 16-BIT, 50 MHz, OTHER DSP, PBGA136 |
| 封裝： | MO-205AE, BGA-136 |
| 文件頁數： | 39/48頁 |
| 文件大小： | 401K |
| 代理商： | ADSP-21262SBBCZ150 |
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ADSP-21262
Rev. B
|
Page 39 of 48
|
August 2005
ENVIRONMENTAL CONDITIONS
The ADSP-21262 processor is rated for performance under
T
AMB
environmental conditions specified in the
Recommended
Operating Conditions on Page 15
.
THERMAL CHARACTERISTICS
Table 32
through
Table 36
airflow measurements comply with
JEDEC standards JESD51-2 and JESD51-6 and the junction-to-
board measurement complies with JESD51-8. Test board and
thermal via design comply with JEDEC standards JESD51-9
(mini-BGA) and JESD51-5 (integrated Heat Sink LQFP). The
junction-to-case measurement complies with MIL-STD-883.
All measurements use a 2S2P JEDEC test board.
Industrial applications using the mini-BGA package require
thermal vias, to an embedded ground plane, in the PCB. Refer to
JEDEC standard JESD51-9 for printed circuit board thermal
ball land and thermal via design information.
To determine the junction temperature of the device while on
the application PCB, use:
where:
T
J
= junction temperature (
°
C)
T
CASE
= case temperature (
°
C) measured at the top center of the
package
Ψ
JT
= junction-to-top (of package) characterization parameter is
the typical value from
Table 32
through
Table 36
(
Ψ
JMT
indi-
cates moving air).
P
D
= power dissipation (see EE Note No. 250 for industrial
applications and No. 216 for commercial)
Values of
θ
JA
are provided for package comparison and PCB
design considerations (
θ
JMA
indicates moving air).
θ
JA
can be
used for a first-order approximation of T
J
by the equation:
where:
T
A
= ambient temperature (
°
C)
Values of
θ
JC
are provided for package comparison and PCB
design considerations when an external heat sink is required.
Values of
θ
JB
are provided for package comparison and PCB
design considerations. Note that the thermal characteristics val-
ues provided in
Table 32
through
Table 36
are modeled values.
Figure 33. Typical Output Delay or Hold vs. Load Capacitance
(at Ambient Temperature)
LOADCAPACITANCE(pF)
0
200
50
100
150
10
8
O
–4
6
0
4
2
–2
Y=0.0488X–1.5923
T
J
T
CASE
Ψ
JT
P
D
×
(
)
+
=
Table 32. Thermal Characteristics for Commercial
Grade 144-Lead LQFP
Parameter
θ
JA
θ
JMA
θ
JMA
θ
JC
Ψ
JT
Ψ
JMT
Ψ
JMT
Typical
32.5
28.9
27.8
7.8
0.5
0.8
1.0
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Table 33. Thermal Characteristics for Commercial
Grade 136-Ball BGA (no thermal vias in PCB)
Parameter
θ
JA
θ
JMA
θ
JMA
θ
JC
Ψ
JT
Ψ
JMT
Ψ
JMT
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
31.0
27.3
26.0
6.99
0.16
0.30
0.35
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Table 34. Thermal Characteristics for Commercial
Grade 136-Ball BGA (with thermal vias in PCB)
Parameter
θ
JA
θ
JMA
θ
JMA
θ
JC
Ψ
JT
Ψ
JMT
Ψ
JMT
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
27.7
24.1
23.0
6.85
0.14
0.26
0.31
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
T
J
T
A
θ
JA
P
D
×
(
)
+
=
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| ADSP-21262SKATZ-200 | 制造商:Analog Devices 功能描述: |
| ADSP-21262SKBC-200 | 功能描述:IC DSP 32BIT 200MHZ 136-CSPBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - DSP（數字式信號處理器） 系列:SHARC® 標準包裝:2 系列:StarCore 類型:SC140 內核 接口:DSI，以太網，RS-232 時鐘速率:400MHz 非易失內存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA，FCBGA 供應商設備封裝:431-FCPBGA（20x20） 包裝:托盤 |
| ADSP-21262SKBC200R | 制造商:Analog Devices 功能描述:DSP Floating-Point 32-Bit 200MHz 200MIPS 136-Pin CSP-BGA T/R |
| ADSP-21262SKBC-200X | 制造商:Analog Devices 功能描述: |
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