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參數資料
| 型號： | FAN5069 |
| 廠商： | Fairchild Semiconductor Corporation |
| 英文描述： | PWM and LDO Controller Combo |
| 中文描述： | PWM和LDO控制器組合 |
| 文件頁數： | 4/20頁 |
| 文件大小： | 379K |
| 代理商： | FAN5069 |
4
www.fairchildsemi.com
FAN5069 Rev. 1.1.0
F
Absolute Maximum Ratings
(Note1)
Thermal Information
Recommended Operating Conditions
Notes:
1. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions above those indicated in the operational section of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Absolute maximum ratings apply individually only, not in combination. Unless otherwise specified all other voltages are referenced
to AGND.
2. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model).
3. Junction to ambient thermal resistance,
θ
, is a strong function of PCB material, board thickness, thickness and number of copper
planes, number of vias used, diameter of vias used, available copper surface, and attached heat sink characteristics.
Parameter
Min.
Max.
Unit
V
CC
to PGND
BOOT to PGND
6
V
33
V
SW to PGND
Continuous
-0.5
33
V
Transient (t < 50nS, F < 500kHz)
-3
33
V
HDRV (V
BOOT
--V
SW
)
LDRV
6
V
-0.5
6
V
All Other Pins
-0.3
V
CC
+0.3
150
V
Maximum Shunt Current for V
CC
Electrostatic Discharge Protection (ESD) Level (Note 2)
mA
HBM
2
kV
CDM
0.4
Parameter
Min.
Typ.
Max.
Unit
Storage Temperature
-65
150
°C
Lead Soldering Temperature, 10 Seconds
300
°C
Vapor Phase, 60 Second
215
°C
Infrared, 15 Seconds
220
°C
Power Dissipation (P
D
), T
A
= 25°C
Thermal Resistance- Junction to Case(
θ
JC
)
Thermal Resistance- Junction to Ambient (
θ
JA
) (Note 3)
715
mW
37
°C/W
100
°C/W
Parameter
Conditions
Min.
Typ.
Max.
Unit
Supply Voltage (V
CC
)
Ambient Temperature (T
A
)
V
CC
to GND
Commercial
4.5
5
5.5
V
-10
85
°C
Industrial
-40
85
°C
Junction Temperature (T
J
)
125
°C
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