
1
Edition 1.2
July 1999
FSU01LG
General Purpose GaAs FET
Item
Drain-Source Voltage
Gate-Source Voltage
Total Power Dissipation
Storage Temperature
Channel Temperature
Symbol
VDS
VGS
12.0
-5
375
-65 to +175
175
Note
V
V
mW
°
C
°
C
Ptot
Tstg
Tch
Condition
Unit
Rating
ABSOLUTE MAXIMUM RATING (Ambient Temperature Ta=25
°
C)
Note:
Mounted on Al2O3 board (30 x 30 x 0.65mm)
Fujitsu recommends the following conditions for the reliable operation of GaAs FETs:
1. The drain-source operating voltage (VDS) should not exceed 6 volts.
2. The forward and reverse gate currents should not exceed 0.7 and -0.1 mA respectively with
gate resistance of 2000
.
3. The operating channel temperature (Tch) should not exceed 145
°
C.
AVAILABLE CASE STYLES:
LG
Note: The RF parameters are measured on a lot basis by sample testing
at an AQL = 0.1%, Level-II inspection. Any lot failure shall be 100% retested.
G.C.P.: Gain Compression Point
Item
Saturated Drain Current
Transconductance
Pinch-off Voltage
Gate Source Breakdown Voltage
Noise Figure
Output Power at 1dB
Gain Compression Point
Power Gain at 1dB
Gain Compression Point
Symbol
IDSS
gm
Vp
VGSO
35
-
-0.7
55
50
-1.2
75
-
-1.7
-5
-
-
18.0
19.0
-
-
0.55
-
19.0
20.0
-
VDS = 3V, IDS = 2.7mA
IGS = -2.7
μ
A
VDS = 3V, IDS = 27mA
VDS = 3V, VGS = 0V
Channel to Case
VDS = 6V
IDS
=
40mA
f = 2GHz
VDS = 3V
IDS
=
10mA
f = 2GHz
mA
mS
V
dB
dB
dBm
V
P1dB
G1dB
NF
Associated Gain
-
18.5
-
dB
Gas
Thermal Resistance
-
300
400
°
C/W
Rth
Test Conditions
Unit
Limit
Typ.
Max.
Min.
ELECTRICAL CHARACTERISTICS (Ambient Temperature Ta=25
°
C)
FEATURES
High Output Power: P1dB= 20.0dBm (Typ.)
High Associated Gain: G1dB= 19.0dB (Typ.)
Low Noise Figure:
NF=0.55dB (Typ.)@f=2GHz
Low Bias Conditions: VDS=3V, 10mA
Cost Effective Hermetic Microstrip Package
Tape and Reel Available
DESCRIPTION
The FSU01LG is a high performance, low noise, GaAs FET designed for
PCS/PCN applications as a driver in the 2GHz band.
Fujitsu’s stringent Quality Assurance Program assures the highest
reliability and consistent performance.