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參數資料
| 型號： | GP1S094HCZ0F |
| 廠商： | Sharp Microelectronics |
| 文件頁數： | 7/9頁 |
| 文件大?。?/td> | 159K |
| 描述： | SENSOR OPTO SLOT 3MM TRANS THRU |
| 產品變化通告： | Internal Chip Change 04/May/2007 |
| 標準包裝： | 100 |
| 檢測距離： | 0.118"（3mm） |
| 檢測方法： | 可傳導的 |
| 輸出配置： | 光電晶體管 |
| 電流 - DC 正向(If)： | 50mA |
| 電流 - 集電極 (Ic)（最大）： | 20mA |
| 電壓 - 集電極發射極擊穿（最大）： | 35V |
| 響應時間： | 50µs，50µs |
| 安裝類型： | 通孔 |
| 封裝/外殼： | PCB 安裝 |
| 包裝： | 管件 |
| 類型： | 無放大 |
| 工作溫度： | -25°C ~ 85°C |
| 產品目錄頁面： | 2776 (CN2011-ZH PDF) |
| 其它名稱： | 425-1964-5 |
7
Sheet No.: D3-A00601EN
GP1S094HCZ0F
?SPAN class="pst GP1S094HCZ0F_2587092_4">Manufacturing Guidelines
?/DIV>
Soldering Method
Flow Soldering:
Soldering should be completed below 260贑 and within 5 s.
Please solder within one time.
Soldering area is 1mm or more away from the bottom of housing.
Please take care not to let any extcrhal force exert on lead pins.
Please don't do soldering with preheating, and please don't do soldering by re ow.
Hand soldering
Hand soldering should be completed within 3 s when the point of solder iron is below 350
C.
Please solder within one time.
Please don't touch the terminals directly by soldering iron.
Soldered product shall treat at normal temperature.
Other notice
Please take care not to let any external force exert on lead pins.
Please test the soldering method in actual condition and make sure the soldering works fine, since the
impact on the junction between the device and PCB varies depending on the cooling and soldering
conditions.
?/DIV>
Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45贑 or below. Immersion time should be 3 minutes or less.
Ultrasonic cleaning :
Do not execute ultrasonic cleaning.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
?/DIV>
Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Speci c brominated ame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
"Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
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相關代理商/技術參數 |
參數描述 |
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| GP1S096HCZ | 功能描述:PHOTOINTERRUPTER SLOT 1.0MM PCB RoHS:否 類別:傳感器，轉換器 >> 光學 - 光斷續器 - 槽型 - 晶體管輸出 系列:- 產品變化通告:Internal Chip Change 04/May/2007 標準包裝:100 系列:- 檢測距離:0.063"（1.6mm） 檢測方法:可傳導的 輸出配置:光電晶體管 電流 - DC 正向(If):50mA 電流 - 集電極 (Ic)（最大）:20mA 電壓 - 集電極發射極擊穿（最大）:35V 響應時間:35µs，35µs 安裝類型:通孔 封裝/外殼:PCB 安裝 包裝:管件 類型:無放大 工作溫度:-25°C ~ 85°C 其它名稱:425-1978-5 |
| GP1S096HCZ0F | 功能描述:光學開關（透射型，光電晶體管輸出） Photointerrupter Sub mini 1.0mm gap RoHS:否 制造商:Omron Electronics 輸出設備:Phototransistor 槽寬:3.4 mm 光圈寬度:0.5 mm 集電極—發射極最大電壓 VCEO:30 V 最大集電極電流:20 mA 正向電流: 安裝風格:Through Hole 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 封裝: |
| GP1S097HCZ | 功能描述:PHOTOINTERRUPTER SLOT 2.0MM PCB RoHS:否 類別:傳感器，轉換器 >> 光學 - 光斷續器 - 槽型 - 晶體管輸出 系列:- 產品變化通告:Internal Chip Change 04/May/2007 標準包裝:100 系列:- 檢測距離:0.063"（1.6mm） 檢測方法:可傳導的 輸出配置:光電晶體管 電流 - DC 正向(If):50mA 電流 - 集電極 (Ic)（最大）:20mA 電壓 - 集電極發射極擊穿（最大）:35V 響應時間:35µs，35µs 安裝類型:通孔 封裝/外殼:PCB 安裝 包裝:管件 類型:無放大 工作溫度:-25°C ~ 85°C 其它名稱:425-1978-5 |
| GP1S097HCZ0F | 功能描述:光學開關（透射型，光電晶體管輸出） Photointerrupter Sub mini 2.0mm gap RoHS:否 制造商:Omron Electronics 輸出設備:Phototransistor 槽寬:3.4 mm 光圈寬度:0.5 mm 集電極—發射極最大電壓 VCEO:30 V 最大集電極電流:20 mA 正向電流: 安裝風格:Through Hole 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 封裝: |
| GP1S10 | 制造商:SHARP 制造商全稱:Sharp Electrionic Components 功能描述:Photointerrupter with Dust Cover |
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