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| 型號(hào)： | ISP1107 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Advanced Universal Serial Bus transceiver |
| 中文描述： | 先進(jìn)的通用串行總線收發(fā)器 |
| 文件頁(yè)數(shù)： | 15/19頁(yè) |
| 文件大?。?/td> | 536K |
| 代理商： | ISP1107 |
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Philips Semiconductors
ISP1107
Advanced USB transceiver
Objective specification
Rev. 01 — 23 February 2000
15 of 19
9397 750 06899
Philips Electronics N.V. 2000. All rights reserved.
Typical dwell time is 4 seconds at 250
°
C. A mildly-activated flux will eliminate the
need for removal of corrosive residues in most applications.
13.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300
°
C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320
°
C.
13.5 Package related soldering information
[1]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board
and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top
version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger
than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[2]
[3]
[4]
[5]
Table 13: Suitability of surface mount IC packages for wave and reflow soldering
methods
Package
Soldering method
Wave
not suitable
not suitable
[2]
Reflow
[1]
suitable
suitable
BGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, SMS
PLCC
[3]
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
not recommended
[3] [4]
not recommended
[5]
suitable
suitable
suitable
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ISP1107DH | Advanced Universal Serial Bus transceivers |
| ISP1107W | Advanced Universal Serial Bus transceivers |
| ISP1109 | Universal Serial Bus transceiver with carkit support |
| ISP1109BS | Universal Serial Bus transceiver with carkit support |
| ISP1122A | Universal Serial Bus stand-alone hub |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISP1107DH | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Advanced Universal Serial Bus transceiver |
| ISP1107W | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Advanced Universal Serial Bus transceivers |
| ISP1109 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Universal Serial Bus transceiver with carkit support |
| ISP1109BS | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Universal Serial Bus transceiver with carkit support |
| ISP1109BS,118 | 功能描述:射頻收發(fā)器 USB FS TRANSCVR RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數(shù)據(jù)速率:2000 Kbps 調(diào)制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
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