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參數(shù)資料
| 型號(hào)： | ISP1160 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Embedded Universal Serial Bus Host Controller |
| 中文描述： | 嵌入式通用串行總線主控制器 |
| 文件頁(yè)數(shù)： | 84/88頁(yè) |
| 文件大小： | 2044K |
| 代理商： | ISP1160 |
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Philips Semiconductors
ISP1160
Embedded USB Host Controller
Product data
Rev. 04 — 04 July 2003
84 of 88
9397 750 11371
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
21. Soldering
21.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC packages. Wave soldering can still
be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In
these situations reflow soldering is recommended. In these situations reflow
soldering is recommended.
21.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 270
°
C depending on solder
paste material. The top-surface temperature of the packages should preferably be
kept:
below 220
°
C (SnPb process) or below 245
°
C (Pb-free process)
–
for all BGA and SSOP-T packages
–
for packages with a thickness
≥
2.5 mm
–
for packages with a thickness < 2.5 mm and a volume
≥
350 mm
3
so called
thick/large packages.
below 235
°
C (SnPb process) or below 260
°
C (Pb-free process) for packages with
a thickness < 2.5 mm and a volume < 350 mm
3
so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all
times.
21.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ISP1160BD | Embedded Universal Serial Bus Host Controller |
| ISP1160BM | Embedded Universal Serial Bus Host Controller |
| ISP1161A | Full-speed Universal Serial Bus single-chip host and device controller |
| ISP1161ABD | Full-speed Universal Serial Bus single-chip host and device controller |
| ISP1161ABM | Full-speed Universal Serial Bus single-chip host and device controller |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISP1160BD | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Embedded Universal Serial Bus Host Controller |
| ISP1160BD,157 | 功能描述:USB 接口集成電路 USB 1.1 HOST CONTROLLER RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1160BD/01 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Embedded Universal Serial Bus Host Controller |
| ISP1160BD/01,118 | 功能描述:USB 接口集成電路 USB HOST CTRL RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1160BD/01,151 | 功能描述:USB 接口集成電路 USB FULL SPEED HOST RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
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