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參數資料
| 型號： | MAX9888EVKIT+ |
| 廠商： | Maxim Integrated Products |
| 文件頁數： | 112/115頁 |
| 文件大小： | 0K |
| 描述： | KIT EVALUATION FOR MAX9888 |
| 產品培訓模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標準包裝： | 1 |
| 系列： | DirectDrive®, FLEXSOUND™ |
| 相關產品： | MAX9888EWY+T-ND - IC CODEC AUDIO FLEXSOUND 63WLP |
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Stereo Audio CODEC
with FlexSound Technology
MAX9888
96
Alternative approaches to eliminating the output-cou-
pling capacitors involve biasing the headphone return
(sleeve) to the DC bias voltage of the headphone ampli-
fiers. This method raises some issues:
U
The sleeve is typically grounded to the chassis. Using
the midrail biasing approach, the sleeve must be
isolated from system ground, complicating product
design.
U
During an ESD strike, the amplifier’s ESD structures
are the only path to system ground. Thus, the ampli-
fier must be able to withstand the full energy from an
ESD strike.
U
When using the headphone jack as a line out to other
equipment, the bias voltage on the sleeve may con-
flict with the ground potential from other equipment,
resulting in possible damage to the amplifiers.
The IC features a low-noise charge pump to generate
a negative supply for the headphone amplifier. The
nominal switching frequency is well beyond the audio
range, and thus does not interfere with audio signals.
The switch drivers feature a controlled switching speed
that minimizes noise generated by turn-on and turn-off
transients. By limiting the switching speed of the charge
pump, the di/dt noise caused by the parasitic trace
inductance is minimized. The charge pump is active only
in headphone modes.
To reduce audible noise at the outputs, the IC’s head-
phone amplifier includes headphone ground sensing.
Connect the sense line (HPSNS) to the ground terminal
of the device’s headphone jack. Any noise present at
the headphone ground is then added to the headphone
output. The result is elimination of this noise from the
audible output. If ground sensing is not required, con-
nect HPSNS directly to ground. Figure 30 shows a block
diagram of the headphone output section including the
headphone sense function.
Headphone Output Mixers
The IC’s headphone amplifier accepts input from the
stereo DAC and the line inputs. The output of the left and
right DAC cannot be mixed at the headphone mixer. Use
MIXDAL/MIXDAR to mix the left and right audio channels
before conversion.
Figure 29. Traditional Amplifier Output vs. DirectDrive Output
Figure 30. Headphone Amplifier Block Diagram
VDD
VDD/2
GND
CONVENTIONAL AMPLIFIER BIASING SCHEME
DirectDrive AMPLIFIER BIASING SCHEME
+VDD
GND
-VDD
(VSS)
MIXHPL
MIXHPR
MIX
PGAOUT2:
0dB TO -23dB
HPVOLL:
+3dB TO -67dB
HPVOLR:
+3dB TO -67dB
PREOUT2
+9dB
PGAOUT1:
0dB TO -23dB
DAREN
HPL
HPSNS
HPLEN
HPREN
HPR
PREOUT1
+9dB
DACR
DALEN
DACL
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相關代理商/技術參數 |
參數描述 |
|---|---|
| MAX9888EVKIT+ | 功能描述:音頻 IC 開發工具 MAX9888 Eval Kit RoHS:否 制造商:Texas Instruments 產品:Evaluation Kits 類型:Audio Amplifiers 工具用于評估:TAS5614L 工作電源電壓:12 V to 38 V |
| MAX9888EWY+T | 功能描述:接口—CODEC Stereo Audio CODEC RoHS:否 制造商:Texas Instruments 類型: 分辨率: 轉換速率:48 kSPs 接口類型:I2C ADC 數量:2 DAC 數量:4 工作電源電壓:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:DSBGA-81 封裝:Reel |
| MAX9889EWO+T | 功能描述:接口—CODEC RoHS:否 制造商:Texas Instruments 類型: 分辨率: 轉換速率:48 kSPs 接口類型:I2C ADC 數量:2 DAC 數量:4 工作電源電壓:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:DSBGA-81 封裝:Reel |
| MAX988ESA | 功能描述:校驗器 IC Single uPower Comparator RoHS:否 制造商:STMicroelectronics 產品: 比較器類型: 通道數量: 輸出類型:Push-Pull 電源電壓-最大:5.5 V 電源電壓-最小:1.1 V 補償電壓（最大值）:6 mV 電源電流（最大值）:1350 nA 響應時間: 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:SC-70-5 封裝:Reel |
| MAX988ESA+ | 功能描述:校驗器 IC Single uPower Comparator RoHS:否 制造商:STMicroelectronics 產品: 比較器類型: 通道數量: 輸出類型:Push-Pull 電源電壓-最大:5.5 V 電源電壓-最小:1.1 V 補償電壓（最大值）:6 mV 電源電流（最大值）:1350 nA 響應時間: 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:SC-70-5 封裝:Reel |
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