
Semiconductor Components Industries, LLC, 2006
February, 2006 Rev. 7
1
Publication Order Number:
MMDFN02E/D
MMDF2N02E
Power MOSFET
2 Amps, 25 Volts
NChannel SO8, Dual
These miniature surface mount MOSFETs feature ultra low R
DS(on)
and true logic level performance. They are capable of withstanding
high energy in the avalanche and commutation modes and the
draintosource diode has a low reverse recovery time. MiniMOS
devices are designed for use in low voltage, high speed switching
applications where power efficiency is important. Typical applications
are dcdc converters, and power management in portable and battery
powered products such as computers, printers, cellular and cordless
phones. They can also be used for low voltage motor controls in mass
storage products such as disk drives and tape drives. The avalanche
energy is specified to eliminate the guesswork in designs where
inductive loads are switched and offer additional safety margin against
unexpected voltage transients.
Features
Ultra Low R
DS(on)
Provides Higher Efficiency and Extends Battery Life
Logic Level Gate Drive Can Be Driven by Logic ICs
Miniature SO8 Surface Mount Package Saves Board Space
Diode Is Characterized for Use In Bridge Circuits
I
DSS
Specified at Elevated Temperatures
Avalanche Energy Specified
Mounting Information for SO8 Package Provided
PbFree Package is Available
MAXIMUM RATINGS
(T
J
= 25
°
C unless otherwise noted)
Rating
Symbol
Value
Unit
DraintoSource Voltage
V
DSS
V
GS
I
D
I
D
I
DM
P
D
T
J
, T
stg
E
AS
25
Vdc
GatetoSource Voltage Continuous
±
20
Vdc
Drain Current Continuous @ T
A
= 25
°
C
Drain Current
Continuous @ T
A
= 100
°
C
Drain Current
Single Pulse (t
p
≤
10 s)
3.6
2.5
18
Adc
Apk
Total Power Dissipation @ T
A
= 25
°
C (Note 1)
Operating and Storage Temperature Range
2.0
W
55 to 150
°
C
Single Pulse DraintoSource Avalanche
Energy Starting T
J
= 25
°
C (V
DD
= 20 Vdc,
V
GS
= 10 Vdc, Peak I
L
= 9.0 Apk,
L = 6.0 mH, R
G
= 25
)
Thermal Resistance, JunctiontoAmbient
(Note 1)
245
mJ
R
JA
62.5
°
C/W
Maximum Lead Temperature for Soldering
Purposes, 0.0625
″
from case for 10 seconds
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Mounted on 2
″
square FR4 board (1
″
sq. 2 oz. Cu 0.06
″
thick single sided) with
one die operating, 10 sec. max.
T
L
260
°
C
Source1
1
2
3
4
8
7
6
5
Gate1
Source2
Gate2
Drain1
Drain1
Drain2
Drain2
2 AMPERES, 25 VOLTS
R
DS(on)
= 100 m
Device
Package
Shipping
ORDERING INFORMATION
MMDF2N02ER2
SO8
2500 Tape & Reel
NChannel
PIN ASSIGNMENT
D
S
G
http://onsemi.com
MMDF2N02ER2G
SO8
(PbFree)
2500 Tape & Reel
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Discrete
(PbFree)
SO8
CASE 751
STYLE 11
MARKING
DIAGRAM
F2N02
A
Y
WW
= Device Code
= Assembly Location
= Year
= Work Week
= PbFree Package
(Note: Microdot may be in either location)
F2N02
AYWW
1
8
1
8