
Semiconductor Components Industries, LLC, 2005
March, 2005 Rev. 4
1
Publication Order Number:
MTP10N10EL/D
MTP10N10EL
Preferred Device
Power MOSFET
10 A, 100 V, Logic Level, NChannel TO220
This Power MOSFET is designed to withstand high energy in the
avalanche and commutation modes. The energy efficient design also
offers a draintosource diode with a fast recovery time. Designed for
low voltage, high speed switching applications in power supplies,
converters and PWM motor controls, these devices are particularly
well suited for bridge circuits where diode speed and commutating
safe operating areas are critical and offer additional safety margin
against unexpected voltage transients.
Features
Avalanche Energy Specified
SourcetoDrain Diode Recovery Time Comparable to a Discrete
Fast Recovery Diode
Diode is Characterized for Use in Bridge Circuits
I
DSS
and V
DS(on)
Specified at Elevated Temperature
PbFree Package is Available
MAXIMUM RATINGS
(T
C
= 25
°
C unless otherwise noted)
Rating
Symbol
Value
Unit
DraintoSource Voltage
V
DSS
100
Vdc
DraintoGate Voltage (R
GS
= 1.0 M )
V
DGR
100
Vdc
GatetoSource Voltage
Continuous
NonRepetitive (t
p
≤
10 ms)
V
GS
V
GSM
±
15
±
20
Vdc
Vpk
Drain Current
Continuous @ T
C
= 25
°
C
Continuous @ T
C
= 100
°
C
Single Pulse (t
p
≤
10 s)
I
D
I
D
I
DM
10
6.0
35
Adc
Apk
Total Power Dissipation @ T
C
= 25
°
C
Derate above 25
°
C
Total Power Dissipation @ T
C
= 25
°
C
(Note 1)
P
D
40
0.32
1.75
Watts
W/
°
C
Watts
Operating and Storage Temperature
Range
T
J
, T
stg
55 to
150
°
C
Single Pulse DraintoSource Avalanche
Energy Starting T
J
= 25
°
C
(V
DD
= 25 Vdc, V
GS
= 5.0 Vdc, Peak
I
L
= 10 Adc, L = 1.0 mH, R
G
= 25 )
E
AS
50
mJ
Thermal Resistance
JunctiontoCase
°
JunctiontoAmbient
JunctiontoAmbient (Note 1)
R
JC
R
JA
R
JA
3.13
100
71.4
°
C/W
Maximum Lead Temperature for Soldering
Purposes, 1/8
″
from case for 10 secs
T
L
260
°
C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. When surface mounted to an FR4 board using the minimum recommended
pad size.
10 A, 100 V
R
DS(on)
= 0.22
Preferred
devices are recommended choices for future use
and best overall value.
Device
Package
Shipping
ORDERING INFORMATION
MTP10N10EL
TO220AB
50 Units/Rail
TO220AB
CASE 221A
STYLE 5
12
3
4
NChannel
D
S
G
MARKING DIAGRAM
& PIN ASSIGNMENT
MTP10N10EL
LL
Y
WW
= Device Code
= Location Code
= Year
= Work Week
MTP10N10EL
LLYWW
1
Gate
3
Source
4
Drain
2
Drain
http://onsemi.com
MTP10N10ELG
TO220AB
(PbFree)
50 Units/Rail
*For additional information on our PbFree strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.