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參數(shù)資料
| 型號： | PCE84C886 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | Microcontroller for monitor OSD and auto-sync applications |
| 中文描述： | 8-BIT, MROM, 10 MHz, MICROCONTROLLER, PDIP42 |
| 封裝： | 0.600 INCH, PLASTIC, SDIP-42 |
| 文件頁數(shù)： | 32/36頁 |
| 文件大小： | 168K |
| 代理商： | PCE84C886 |
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1996 Feb 21
32
Philips Semiconductors
Objective specification
Microcontrollers for digital auto-sync and
VST TV controller applications
PCE84C486; PCE84C487
18 SOLDERING
18.1
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook”(order code 9398 652 90011).
18.2
SDIP
18.2.1
S
OLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260
°
C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
18.2.2
R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
°
C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
°
C, contact may be up to 5 seconds.
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