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| 型號： | S29CL032J0RFAN130 |
| 廠商： | SPANSION LLC |
| 元件分類： | PROM |
| 英文描述： | 1M X 32 FLASH 3.3V PROM, 48 ns, PBGA80 |
| 封裝： | 13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-80 |
| 文件頁數(shù)： | 7/78頁 |
| 文件大小： | 1825K |
| 代理商： | S29CL032J0RFAN130 |
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September 27, 2006 S29CD-J_CL-J_00_B1
S29CD-J & S29CL-J Flash Family
13
Pr el im i n a r y
5.4
LAA080–80-ball Fortified Ball Grid Array (13 x 11 mm) Physical
Dimensions
3214\38.12C
PACKAGE
LAA 080
JEDEC
N/A
13.00 x 11.00 mm
NOTE
PACKAGE
SYMBOL
MIN
NOM
MAX
A
--
1.40
PROFILE HEIGHT
A1
0.40
--
STANDOFF
A2
0.60
--
BODY THICKNESS
D
13.00 BSC.
BODY SIZE
E
11.00 BSC.
BODY SIZE
D1
9.00 BSC.
MATRIX FOOTPRINT
E1
7.00 BSC.
MATRIX FOOTPRINT
MD
10
MATRIX SIZE D DIRECTION
ME
8
MATRIX SIZE E DIRECTION
N
80
BALL COUNT
φb
0.50
0.60
0.70
BALL DIAMETER
eD
1.00 BSC.
BALL PITCH - D DIRECTION
eE
1.00 BSC.
BALL PITCH - E DIRECTION
SD/SE
0.50 BSC
SOLDER BALL PLACEMENT
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010
(EXCEPT AS NOTED).
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE "D"
DIRECTION. SYMBOL "ME" IS THE BALL COLUMN MATRIX
SIZE IN THE "E" DIRECTION. N IS THE TOTAL NUMBER OF
SOLDER BALLS.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW. WHEN THERE IS AN ODD NUMBER
OF SOLDER BALLS IN THE OUTER ROW PARALLEL TO THE D
OR E DIMENSION, RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW , SD OR SE = e/2
8.
N/A
9.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
BOTTOM VIEW
SIDE VIEW
TOP VIEW
2X
C
0.20
C
0.20
6
7
A
C
φ0.10
φ0.25 M
M
B
C
0.25
0.15 C
A
B
C
SEATING PLANE
J
K
eD
(INK OR LASER)
CORNER
A1
A2
D
E
φ0.50
A1 CORNER ID.
1.00±0.5
A
A1
CORNER
A1
NX
φb
SD
SE
eE
E1
D1
1
2
3
4
5
6
7
8
A
CB
D
FE
G
H
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